Semiconductor Die Bonding With IR Pick-and-Place Alignment
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Solution Overview
Problem
The accuracy in the placement of dies on wafers or package substrates during the bonding process in integrated circuit manufacturing is challenging, affecting the yield, and existing optical alignment methods are inefficient, impacting throughput.
Innovation Solution
The use of an infrared (IR) detection device installed on a pick-and-place tool for simultaneous alignment and movement of dies, allowing for precise alignment of alignment marks on both the die and wafer, enabling hybrid or fusion bonding with high-density conductive structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external optical detectors are used for alignment, then alignment can be performed, but the process requires moving detectors in and out which reduces efficiency and throughput
Solution Approach 1:
The patent combines the alignment detection function directly into the pick-and-place tool by integrating an infrared detection device. This eliminates the need for separate external optical detectors that require moving in and out, thereby maintaining alignment accuracy while significantly improving throughput and efficiency.
Solution Approach 2:
The patent introduces infrared detection devices as an intermediary mechanism within the pick-and-place tool. These devices enable alignment detection during the die placement process itself, rather than requiring separate alignment steps with external detectors, thus resolving the contradiction between measurement precision and productivity.
2Productivity
If traditional bonding processes are used, then dies can be bonded to wafers, but alignment accuracy is difficult to control affecting yield
Solution Approach 1:
The patent implements a feedback mechanism where the infrared detection device continuously monitors the position of alignment marks on the die and wafer during the placement process. The system uses this real-time feedback information to adjust the die position, ensuring high placement accuracy while maintaining bonding capability.
Solution Approach 2:
The patent replaces traditional mechanical alignment methods with an infrared optical detection system. This substitution enables more precise measurement and control of die placement position, improving manufacturing precision without compromising the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances alignment accuracy and efficiency, improving the throughput of the bonding process by eliminating the need for external optical detectors and allowing for high-resolution alignment of small bonding pads.
Implementation Method 1
an infrared (IR) detection device installed on a pick-and-place tool for simultaneous alignment and movement of dies
Data Source
AI summary
A method of manufacturing a semiconductor structure includes following operations: moving a die towards a wafer by a pick-and-place tool, the pick-and-place tool including an infrared (IR) detection device attached to the pick-and-place tool in a fixed relationship; aligning the die with the wafer by using the IR detection device, and bonding the die to the wafer.