3D Die Bonding Pads With Locking Patterns for Stronger Interfaces
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Solution Overview
Problem
Existing semiconductor manufacturing technologies face challenges in establishing reliable electrical inter-connection between semiconductor dies and other devices, particularly in complex 3D integration structures, leading to issues with bonding strength and reliability at interfaces.
Innovation Solution
The implementation of locking auxiliary patterns within bonding pads, which are formed with specific crystalline orientations, allows for hybrid bonding processes at lower temperatures, resulting in fused core pads with no significant interfaces and enhanced bonding strength through the formation of large grains during thermal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding processes are used to establish electrical inter-connection between semiconductor dies, then bonding can be achieved, but bonding strength and reliability at interfaces are insufficient
Solution Approach 1:
The patent applies preliminary action by forming auxiliary patterns within bonding pads before the bonding process. These pre-formed patterns with specific crystalline orientations prepare the bonding interface in advance, enabling enhanced bonding strength through subsequent thermal processing without requiring complex real-time control during bonding.
Solution Approach 2:
The patent utilizes parameter changes by controlling the crystalline orientation of auxiliary patterns and applying specific thermal processing parameters. By changing the crystalline structure parameters and thermal treatment conditions, the bonding strength is significantly enhanced while maintaining process feasibility.
2Strength
If high temperature bonding is used to enhance bonding strength, then bonding strength increases, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent changes the crystalline orientation parameter of the auxiliary patterns to enable effective bonding at lower temperatures. By optimizing the crystalline structure parameters, the bonding process can be performed at reduced temperatures while still achieving enhanced bonding strength, thereby reducing manufacturing complexity and cost.
Solution Approach 2:
The patent employs composite structures by combining auxiliary patterns with specific crystalline orientations within the bonding pads. This composite approach at the micro-structural level enables effective bonding at lower temperatures by leveraging the enhanced interfacial properties provided by the crystalline patterns.
3Reliability
If simple bonding pads are used, then manufacturing is easier, but bonding strength and reliability are insufficient
Solution Approach 1:
The patent applies segmentation by dividing the bonding pad structure into functional components: auxiliary patterns with specific crystalline orientations are segmented within the bonding pad area. This segmentation creates distinct functional zones that enhance bonding reliability while maintaining overall structural simplicity and manufacturability.
Solution Approach 2:
The auxiliary patterns act as intermediaries between the bonding pad materials. These intermediate structures with specific crystalline orientations facilitate reliable electrical inter-connection by improving the interfacial bonding properties, thereby enhancing overall connection reliability without significantly increasing device complexity.
4Strength
If locking auxiliary patterns with specific crystalline orientations are formed in bonding pads, then bonding strength increases by 20% to 30%, but manufacturing process complexity increases
Solution Approach 1:
The locking auxiliary patterns are formed as preliminary structures before bonding. By pre-forming these patterns with specific crystalline orientations, the complex structural enhancement is achieved in advance during standard fabrication processes, avoiding the need for complex post-bonding operations or specialized bonding equipment.
Solution Approach 2:
The patent utilizes parameter changes in the form of crystalline orientation control during standard fabrication processes. By adjusting crystalline growth parameters during pattern formation, the enhanced bonding strength is achieved through material property optimization rather than through complex manufacturing steps, thereby maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases bonding strength by 20% to 30% and ensures reliable electrical connections by forming homogeneous core pads with reduced voids and defects, enhancing the durability and performance of 3D stacking structures.
Implementation Method 1
locking auxiliary patterns within bonding pads, which are formed with specific crystalline orientations, allows for hybrid bonding processes at lower temperatures, resulting in fused core pads with no significant interfaces and enhanced bonding strength through the formation of large grains during thermal processes
Implementation Method 2
enhanced bonding strength through the formation of large grains during thermal processes
Data Source
AI summary
A stacking structure including a first die and a second die stacked the first die is provided. The first die includes a first substrate and a first bonding structure located over the first substrate. The second die includes a second substrate and a second bonding structure located over the second substrate. The first and second dies are bonded through the bonded first and second bonding structures. The bonded first and second bonding structures include fused bonding pads having homogeneous core pads and locking patterns surrounding the homogeneous core pads.