Die Bonding Optical Alignment for Sub-Micron Hybrid Bonding
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Solution Overview
Problem
Conventional flip chip bonding systems lack the accuracy required for sub-micron level placement, particularly in hybrid bonding applications, due to limitations in handling and alignment techniques.
Innovation Solution
A die bonding system with an imaging system that utilizes multiple optical paths and fiducial markings to achieve precise alignment, incorporating independent optical systems or a scanning mirror for simultaneous imaging of fiducial markings on both the die and substrate, allowing for sub-micron level precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional handling and alignment techniques are used in flip chip bonding, then the process is simple and easy to implement, but the placement accuracy cannot achieve sub-micron level (0.2 μm at 3σ)
Solution Approach 1:
The patent replaces conventional mechanical alignment techniques with an optical imaging system that uses multiple optical paths and fiducial markings to achieve sub-micron placement accuracy. The imaging system captures images of fiducial markings on both the die and substrate, enabling precise alignment without complex mechanical adjustments.
Solution Approach 2:
The patent introduces fiducial markings as intermediary reference features on both the die and substrate. These fiducial markings serve as mediators for the alignment process, allowing the imaging system to precisely determine relative positions and achieve sub-micron placement accuracy through optical measurement rather than direct mechanical alignment.
2Measurement precision
If multiple optical paths are used for simultaneous imaging of fiducial markings, then alignment precision is improved to sub-micron level, but the imaging system complexity increases
Solution Approach 1:
The patent divides the imaging function into multiple independent optical paths, each capable of imaging fiducial markings on the die and substrate. This segmentation allows simultaneous imaging of multiple reference features, enabling precise alignment measurements while maintaining modular system architecture that manages complexity through functional decomposition.
Solution Approach 2:
The imaging system is designed with multiple optical paths that can independently and simultaneously image different fiducial markings on both the die and substrate. This multi-functionality allows the system to capture multiple reference points in parallel, improving alignment precision through comprehensive spatial measurement without requiring sequential operations.
3Adaptability or versatility
If independent optical paths are configured to image any area of the die including fiducial markings, then flexibility and adaptability of alignment are improved, but system complexity and configuration requirements increase
Solution Approach 1:
The patent implements dynamically configurable optical paths that can be independently directed to image any area of the die or substrate containing fiducial markings. The optical system allows real-time adjustment of imaging targets, providing adaptability for different die sizes, layouts, and fiducial positions while maintaining a unified imaging platform that manages configuration complexity through software control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables high-precision alignment and bonding with sub-micron accuracy, enhancing the placement accuracy in hybrid bonding by using independent optical paths and fiducial markings for precise die-to-substrate alignment.
Implementation Method 1
an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path
Data Source
AI summary
A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.