Die Bonding Template Registration Using Pad Pattern Detection
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Solution Overview
Problem
Existing die bonding apparatuses face challenges in accurately positioning semiconductor chips due to the increasing thickness reduction of dice, requiring manual registration of models for template matching, which is inefficient and prone to errors.
Innovation Solution
A die bonding apparatus with a control device that automatically detects dicing grooves, calculates the central position of dice, aligns the optical axis, and registers specific pad arrangements as a template model, enabling automated template matching registration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual registration of models for template matching is performed, then positioning accuracy can be achieved, but operation efficiency deteriorates and human error increases
Solution Approach 1:
The system performs automatic model registration by having the die bonding apparatus itself capture images of the die, detect pad positions, and register templates without human intervention. The apparatus uses its own imaging devices and processing capabilities to complete the registration task autonomously, eliminating dependency on manual operations while maintaining positioning accuracy.
Solution Approach 2:
The manual mechanical process of model registration is replaced with an automated optical and computational system. Imaging devices capture die images, image processing algorithms detect pad positions and determine coordinate systems, and software automatically registers templates. This substitution of manual mechanical operations with automated optical-computational processes dramatically improves efficiency while preserving accuracy.
2Measurement precision
If manual registration of models for template matching is performed, then positioning accuracy can be achieved, but error rate increases due to human factors
Solution Approach 1:
The system eliminates human involvement in the model registration process by performing all operations automatically. The apparatus captures images, processes them through algorithms, detects pad positions, determines coordinate systems, and registers templates without human intervention, thereby eliminating human error sources entirely.
Solution Approach 2:
The system uses imaging devices to capture actual die images, compares them with reference templates, detects pad positions, and automatically adjusts the coordinate system based on the detected features. This closed-loop feedback process ensures accurate registration while eliminating variability introduced by manual operations.
3Productivity
If automated template matching is implemented, then operation speed improves, but system complexity increases
Solution Approach 1:
The die bonding apparatus is equipped with multi-functional capabilities including imaging devices for capturing die images, image processing units for detecting pad positions, coordinate system determination algorithms, and template registration software. These integrated functions work together to automate the entire model registration process, achieving high speed operation despite the increased complexity through unified system design.
4Productivity
If automated model registration is performed, then productivity improves, but measurement complexity increases
Solution Approach 1:
Manual measurement and registration operations are replaced with automated image capture and computational processing. Imaging devices photograph the die, image processing algorithms detect pad positions and determine coordinate systems, and software automatically completes the template registration. This substitution transforms complex manual measurement tasks into automated optical-computational processes, improving productivity while managing complexity through algorithmic approaches.
Data Source
AI summary
A die bonding apparatus includes a control device for controlling an imaging device. The control device is configured to: detect the dicing grooves by photographing the wafer using the imaging device; roughly determine a central position of the die by calculating the center coordinate of the die on the basis of the detected dicing grooves; move a center of the die to a center of an optical axis of the imaging device on the basis of the center coordinate; photograph the moved die by the imaging device and detect positions of pads possessed by the die on the basis of an image of the photographed die; detect a specific pad arrangement having a unique pitch on the basis of the detected dispositions of the pads; and register the detected specific pad arrangement as a template model.