Die Bonding Template Registration Using Pad Pitch Recognition
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Solution Overview
Problem
Existing die bonding apparatuses require manual registration of models for template matching, which is time-consuming and prone to human error, especially with the increasing complexity and miniaturization of semiconductor chips.
Innovation Solution
The die bonding apparatus is equipped with a control device that automatically detects dicing grooves, calculates the center coordinate of the die, moves the die to the center of the optical axis, photographs the die, detects pad positions, and registers a specific pad arrangement as a template model, enabling automated registration for template matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual registration of models for template matching is performed, then the operator can select and register unique portions, but the process is time-consuming and prone to human error
Solution Approach 1:
The system performs automatic model registration by having the die itself provide the unique portion information through its pad arrangement. The control device automatically detects pad positions, calculates pitch, and registers the model without requiring operator intervention, making the system self-sufficient for model registration
Solution Approach 2:
The manual mechanical operation of selecting and registering models is replaced by an automated optical and computational system. The imaging device captures images, the control device processes the data to detect pad arrangements, and automatically completes the registration process, substituting human manual operations with automated mechanical and computational systems
2Length of moving object
If the thickness of dice is reduced, then the semiconductor chip size is minimized, but the requirement for accurate pickup without fail increases significantly
Solution Approach 1:
The system replaces manual visual inspection and mechanical positioning with an automated optical imaging and computational recognition system. The imaging device captures high-resolution images of the die, and the control device automatically detects unique portions and calculates precise positions, enabling reliable pickup of thin dice without human intervention
Solution Approach 2:
The system creates a digital copy (image) of the die and its unique portion, then processes this copy to extract position information. This allows the system to accurately determine die positions and orientations without physically contacting or disturbing the thin die structure
3Measurement precision
If template matching is used for die position recognition, then positioning accuracy is improved, but the process requires manual model selection and registration
Solution Approach 1:
The system automatically identifies and registers the unique portion model by detecting the pad arrangement on the die itself. The control device performs all necessary operations including image capture, pad position detection, pitch calculation, and model registration without requiring operator input, making the template matching process fully automated
Solution Approach 2:
The system performs preliminary detection of pad arrangements and automatic model registration before the actual template matching process. By pre-registering the model automatically, the system prepares the necessary reference data in advance, enabling subsequent template matching operations to proceed without manual intervention
Data Source
AI summary
A die bonding apparatus includes a control device for controlling an imaging device. The control device is configured to: detect the dicing grooves by photographing the wafer using the imaging device; roughly determine a central position of the die by calculating the center coordinate of the die on the basis of the detected dicing grooves; move a center of the die to a center of an optical axis of the imaging device on the basis of the center coordinate; photograph the moved die by the imaging device and detect positions of pads possessed by the die on the basis of an image of the photographed die; detect a specific pad arrangement having a unique pitch on the basis of the detected dispositions of the pads; and register the detected specific pad arrangement as a template model.