Die-to-Die Bonding Structure With Positioning Member Alignment
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently bonding stacked semiconductor devices with sophisticated techniques, requiring improved methods for aligning and bonding separate substrates to enhance integration density and reduce physical size.
Innovation Solution
A semiconductor structure and method involving a positioning member within the bonding dielectric to align and bond a second die over a first die, using a recess in the first bonding layer and a second bonding layer, allowing for thermal expansion buffer and hybrid bonding techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If stacked and bonded semiconductor devices are used to reduce physical size, then integration density is improved, but bonding process complexity increases
Solution Approach 1:
Alignment marks are formed on the semiconductor wafers before the bonding process. These pre-formed marks enable automated alignment systems to quickly and accurately position wafers during bonding, eliminating the need for complex real-time alignment procedures and reducing overall process complexity while maintaining high integration density
Solution Approach 2:
The alignment marks serve as intermediary reference features that mediate between the wafer positioning system and the bonding process. By providing fixed, pre-defined reference points, these marks simplify the coordination between multiple subsystems (positioning, alignment, bonding) and reduce the complexity of the overall bonding process
2Reliability
If sophisticated bonding techniques are used to bond separate substrates, then device functionality is improved, but manufacturing difficulty increases
Solution Approach 1:
Alignment marks are formed on the semiconductor wafers before the bonding process. These pre-formed marks enable automated alignment systems to quickly and accurately position wafers during bonding, eliminating the need for complex real-time alignment procedures and reducing overall process complexity while maintaining high integration density
Solution Approach 2:
The alignment marks are self-aligned features that are formed as part of the standard fabrication process. During bonding, the automated alignment system uses these marks to automatically position the wafers without requiring manual intervention or complex external alignment tools, thereby simplifying the manufacturing process while ensuring accurate alignment and reliable device functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise alignment and bonding of semiconductor devices, improving integration density and reducing physical size while accommodating thermal expansion, thus enhancing the efficiency of stacked semiconductor devices.
Implementation Method 1
a coefficient of thermal expansion of the bonding dielectric and a coefficient of thermal expansion of the positioning member are different
Data Source
AI summary
A method for forming a semiconductor structure includes receiving a first die having a first interconnect structure and a first bonding layer over the first interconnect structure, and a second die having a second interconnect structure and a second bonding layer over the second interconnect structure; forming a recess indenting into the first bonding layer; and forming a positioning member on the second bonding layer. The method further includes bonding the second die over the first die; and disposing the positioning member into the recess. The positioning member includes dielectric, is surrounded by the first bonding layer, and is isolated from the first interconnect structure and the second interconnect structure.