Die Bonding Method Using Positive Pressure Bending for Void-Free Contact
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Solution Overview
Problem
Current die-to-wafer bonding technologies face challenges such as bubble formation, voids, damage from impact force, and high manufacturing costs due to the difficulty in controlling bonding waves on smaller dies, especially when using traditional solder bonding or elastic members.
Innovation Solution
A die bonding method that uses a die bonding device to pick up a die without solder or bumps, moves it to the substrate using negative pressure, applies positive pressure to bend a corner or side for contact, and forms a bonding wave that spreads across the die surface without impact, eliminating the need for elastic members and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional die-to-wafer bonding technology is used, then the die can be bonded to the substrate, but bubbles and voids are easily formed causing poor adhesion and reduced yield rate
Solution Approach 1:
The die bonding device performs preliminary actions by first sucking the die onto its bottom surface, then moving it to the die placement area, and finally separating from the die before bonding occurs. This preliminary positioning and preparation prevents bubbles from being trapped during the bonding process, ensuring proper adhesion between the die and substrate.
2Productivity
If the die is transferred by tossing method, then the die can be moved to the substrate, but impact force damages the die and accurate placement is difficult
Solution Approach 1:
The die bonding device acts as an intermediary carrier that holds the die on its bottom surface through suction. This intermediary mechanism allows the die to be transported without impact and placed accurately on the substrate, eliminating the harmful effects of direct tossing while maintaining efficient transfer.
3Manufacturing precision
If elastic members with different K values are used, then the die can be accurately positioned with center first contact, but the elastic members provide large mass inertia causing greater impact force and damage
Solution Approach 1:
The invention extracts and removes the elastic members from the die bonding device entirely. Instead of using elastic members to position the die, the device uses suction on the bottom surface of the die to achieve accurate placement. This eliminates the mass inertia problem while maintaining precise positioning capability.
4Manufacturing precision
If elastic members are installed in the die bonding device, then the die can be accurately transferred, but the device complexity increases and manufacturing cost becomes high
Solution Approach 1:
The invention removes the complex elastic member system from the die bonding device. The simplified device uses only a suction mechanism on the bottom surface to achieve accurate die transfer and placement, significantly reducing device complexity and manufacturing cost while maintaining precision.
5Productivity
If bonding speed is increased, then productivity improves, but the die is easily damaged, skewed or bent
Solution Approach 1:
The die bonding device performs preliminary positioning by sucking the die onto its bottom surface and moving it to the placement area before bonding. This preliminary action ensures the die is properly positioned and stable, allowing faster bonding speeds without damaging or skewing the die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures precise, damage-free bonding with minimal force, prevents bubble formation, and lowers manufacturing costs by using non-impact positive pressure to attach the die to the substrate, improving yield rates and reducing assembly complexity.
Implementation Method 1
picking up a die by a die bonding device
Implementation Method 2
blowing one corner or one side of the die by a positive pressure provided from the die bonding device
Data Source
AI summary
A die bonding method with corner or side contact without impact force includes the steps: picking up a die by a die bonding device, wherein a surface of the die has no solder and bump; moving the die to one side of a die placement area of a substrate, wherein the substrate has no solder and bump; blowing one corner or one side of the die a positive pressure from the die bonding device to bend the corner/side to contact the die placement area; forming a bonding wave after the corner/side of the die contacting the die placement area, and spreading the bonding wave from the corner/side to opposite corner/side of the die, and separating the die from the die bonding device gradually and bonding the die on the die placement area; and bonding the die on the die placement area completely.