Die Bonding Push-Up Sequence for Thin Die Peeling Stress
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Solution Overview
Problem
The thinning of semiconductor wafers has led to reduced rigidity of dies, making it challenging to reduce stress during the peeling-off process from dicing tape without causing deformation or breakage.
Innovation Solution
A die bonding apparatus with a push-up unit that includes a control device to lift blocks in a specific sequence, stopping the outermost block at a predefined height and lifting inner blocks further, reducing stress by controlling the overhang length and height to minimize deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a die with thickness less than several tens of micrometers is picked up, then the rigidity of the die becomes extremely low, but it is necessary to reduce stress applied to the die to prevent deformation or breakage
Solution Approach 1:
The push-up unit is divided into multiple blocks (first block, second block, third block) arranged in different positions. Each block can be pushed up independently or in sequence, allowing staged support of the die during peeling. This segmentation enables controlled stress distribution across different regions of the thin die.
Solution Approach 2:
The first block is pushed up in advance before the second and third blocks. This preliminary action provides initial support to the die at a specific location, creating a controlled overhang configuration that minimizes stress on the thin die structure during the subsequent peeling process.
Solution Approach 3:
The collet acts as an intermediary tool that holds the die during transfer. By coordinating the block push-up sequence with collet positioning, the die is supported by both the block structure and the collet simultaneously, distributing stresses and preventing deformation during the critical peeling and transfer operations.
2Ease of operation
If blocks are lifted to peel off the die from dicing tape, then the die can be transferred, but stress concentration may cause deformation or breakage of the thin die
Solution Approach 1:
The push-up unit uses multiple segmented blocks that can be actuated independently. The first block is pushed up to create initial separation, followed by sequential pushing of the second and third blocks. This staged segmentation allows the die to be peeled gradually with controlled stress at each stage, preventing sudden stress concentration that would cause breakage.
Solution Approach 2:
The first block is pushed up in advance of the other blocks, creating a preliminary support structure and controlled overhang. This preliminary action prepares the die for subsequent peeling by establishing a stress-distributing configuration before the main peeling force is applied by the second and third blocks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces stress on the die, preventing deformation and breakage, while improving productivity by optimizing the peeling-off process.
Implementation Method 1
suck a dicing tape using a dome plate
Implementation Method 2
suck the die using the collet
Data Source
AI summary
A die bonding apparatus includes a push-up unit, a head having a collet that sucks a die, and a control device. The control device is configured to suck a dicing tape using a dome plate; land the collet onto the die using the head; suck the die using the collet; lift plural blocks from the dome plate; stop the outermost block disposed on the outermost side among the plural blocks from lifting at a height where the die is peeled off from the dicing tape; and lift blocks other than the outermost block among the plural blocks higher than the outermost block to a predefined height.