Die Bonding Quality Grade Matching for Chip Uniformity
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Solution Overview
Problem
Current die bonding methods do not ensure consistent chip quality as they do not consider the quality grade of each die during the bonding process, leading to potential variations in chip performance when dies of different grades are randomly bonded.
Innovation Solution
A die bonding method and apparatus that assess the quality grade of each die, identify specific bonding locations on a substrate based on the die's grade, and bond the die to those locations, ensuring that dies of the same grade are placed in corresponding positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If dies are randomly bonded to substrate without quality consideration, then bonding process is simple and fast, but chip quality consistency deteriorates
Solution Approach 1:
The patent applies preliminary action by obtaining quality grade information about each die before the bonding process. The controller stores quality information for each die location and uses this pre-acquired data to determine bonding locations, eliminating the need for real-time quality assessment during bonding and maintaining process efficiency while ensuring quality consistency.
Solution Approach 2:
The patent implements local quality by matching specific quality grades of individual dies with corresponding quality levels of bonding locations on the substrate. Different regions of the substrate are designated for different die grades, ensuring that high-quality dies are placed in critical areas while lower-quality dies are placed in less critical areas, thereby maintaining overall chip quality consistency.
2Manufacturing precision
If quality information is obtained and processed for each die, then chip quality consistency is improved, but processing time increases
Solution Approach 1:
Quality information about each die is obtained and stored in advance at designated locations on the wafer or in a database before the bonding process begins. This preliminary acquisition of quality data eliminates the need for time-consuming quality checks during the actual bonding operation, as the controller can directly reference pre-stored quality information to determine optimal bonding locations.
Solution Approach 2:
The patent uses a copy or representation of quality information (such as a quality map or data structure stored in the controller) that mirrors the physical wafer layout. This digital copy allows the controller to quickly query and process quality data without physically inspecting each die during bonding, significantly reducing processing time while maintaining quality consistency.
3Reliability
If dies are sorted by quality grade and bonded to specific locations, then chip performance uniformity is enhanced, but bonding process complexity increases
Solution Approach 1:
The patent applies local quality by dividing the substrate into multiple bonding locations with different quality levels or requirements. Each die is matched to a bonding location that corresponds to its quality grade, ensuring that high-quality dies are placed in critical performance areas while lower-quality dies are placed in less critical areas. This localized quality matching enhances chip performance uniformity without requiring complete reorganization of the bonding process.
Solution Approach 2:
The system uses feedback from pre-obtained quality information to automatically determine bonding locations. The controller receives quality data about each die, processes this information, and uses it to select appropriate bonding locations on the substrate. This closed-loop approach ensures that quality considerations are systematically integrated into the bonding process without manual intervention, managing complexity through automation.
Data Source
AI summary
A die bonding method includes obtaining information about a quality grade of each die of a plurality of dies placed at a wafer, picking up a first die among the plurality of dies from the wafer, identifying a bonding location of a plurality of bonding locations from a substrate according to a quality grade of the first die, and bonding the first die to the bonding location of the substrate.