Die Bonding Carrier Alignment Using Optical Reference Keys

The patent uses reference keys as physical copies or markers of ideal positions. The chuck reference key and bonding head reference key serve as standardized position markers that can be optically detected and used to calculate actual positions, replacing complex mechanical positioning systems with simpler optical measurement and computational correction.

The patent replaces traditional mechanical positioning systems with an optical measurement system. Instead of relying on precise mechanical alignment and physical guides, the system uses cameras to capture images of reference keys, processes the image data computationally to determine positions, and corrects any deviations through calculation, thereby substituting mechanical complexity with optical and computational methods.

The reference keys serve as simplified optical copies or markers that represent complex position information in a visually detectable form. The camera captures images of these simple key structures, and the control device processes the image data to extract precise position information, replacing complex direct measurement systems with simpler optical markers and image processing.

The reference keys act as intermediaries between the physical positioning system and the optical measurement system. Instead of the camera directly measuring complex mechanical positions, it simply captures images of the reference keys, which then serve as intermediaries for the control device to calculate actual positions and deviations, simplifying the overall measurement chain.

The patent performs preliminary positioning by placing reference keys at known ideal positions before the actual die attachment process. The system captures images of these reference keys, calculates positional deviations in advance, and determines correction values before the bonding head performs die placement, allowing for efficient real-time correction without adding significant process time.

The system implements feedback by continuously monitoring the positions of reference keys through image capture, calculating deviations from ideal positions, and using these calculations to correct the positioning of the bonding head and die placement locations. This closed-loop feedback ensures high attachment reliability while maintaining efficient process timing through automated real-time correction.