Die-Bonding Alignment Using Reflector-Based Positioning Marks
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Solution Overview
Problem
Conventional die-bonding devices experience deviations during die placement on a substrate, leading to inaccurate alignment of dies on the substrate due to slight positioning errors.
Innovation Solution
An encapsulation positioning mark method that utilizes multiple image capture units, reflectors, and correction sheets to obtain templates and accurately align the die-bonding device with the substrate's die placement area by maintaining a stationary first image capture unit and adjusting the die-bonding device's position based on obtained templates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the first image capture unit moves downward to capture clear images of marks at different focal lengths, then image clarity is improved, but device complexity and positioning accuracy requirements increase
Solution Approach 1:
The patent introduces a reflector as an intermediary component between the first image capture unit and the marks. The reflector redirects light paths to enable the stationary image capture unit to capture images of marks at different positions without physically moving, thereby resolving the contradiction between maintaining image clarity and avoiding complex movement mechanisms
Solution Approach 2:
The patent divides the positioning system into multiple functional components: a stationary first image capture unit for capturing mark images, a second image capture unit for capturing die-bonding device images, and a reflector system. This segmentation allows each component to perform its function optimally without requiring the image capture unit to move, reducing device complexity while maintaining measurement precision
2Manufacturing precision
If marks outside the die placement area are used for positioning, then alignment accuracy is improved, but the marks may be blocked by the die-bonding device or correction sheet
Solution Approach 1:
The patent utilizes the spatial dimension created by the reflector to capture images of marks that would otherwise be blocked. By redirecting light paths, the system can capture images of marks positioned strategically where they provide accurate alignment information without being obstructed by the die-bonding device or correction sheet during the actual bonding process
3Manufacturing precision
If the die-bonding device is moved to align with the die placement area, then positioning accuracy is improved, but positioning time increases due to multiple adjustment steps
Solution Approach 1:
The patent performs preliminary imaging and calculation of the die placement area position before the die-bonding device arrives. The system captures images of marks, calculates the die placement area position in advance, and prepares alignment data so that when the die-bonding device arrives, it can be quickly positioned with minimal adjustment time, reducing overall positioning time while maintaining high accuracy
Solution Approach 2:
The patent implements a feedback mechanism where the system continuously monitors the position of marks and the die-bonding device, calculates positional deviations, and provides real-time correction instructions. This closed-loop feedback system enables rapid, accurate positioning without requiring multiple manual adjustment steps, thereby reducing positioning time while maintaining high positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures precise alignment of the die-bonding device with the substrate's die placement area, enhancing the accuracy of die placement without requiring the first image capture unit to move, thereby improving positioning accuracy.
Implementation Method 1
synchronously moving a die-bonding device, at least one reflector and at least one correction sheet to below at least one first image capture unit, until the at least one first image capture unit indirectly and clearly captures an image of at least one mark of the correction sheets through the reflection of the at least one reflector
Data Source
AI summary
An encapsulation positioning mark method includes: synchronously moving a die-bonding device, a reflector and a correction sheet below a first image capture unit until the first image capture unit clearly captures an image of a mark on the correction sheet through the reflector to obtain a first template; synchronously moving the die-bonding device, the reflector and the correction sheet away from the first image capture unit, moving a substrate below the first image capture unit until the first image capture unit clearly captures an image of a mark on a die placement area of the substrate to obtain a position of the die placement of the substrate; and synchronously moving the die-bonding device, the reflector and the correction sheet to a preset position according to the first template and the position of the die placement of the substrate, so that the die-bonding device is aligned with the die placement area.