Die Bonding Head With Side Heating for Uniform Die Temperature
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Solution Overview
Problem
In die bonding processes, non-uniform temperature distribution across the die can lead to poor adhesion and warpage issues due to in-plane heating and external heat exposure, affecting the physical properties of adhesive films.
Innovation Solution
A bonding head with a thermal pressurizer for heating and a thermal compensator that includes heat reflective surfaces to control 3-dimensional temperature distribution, ensuring uniform heat flux and adhesion properties by reflecting heat back to the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal pressurizer heats the die from the bottom surface, then the die can be bonded to the substrate, but non-uniform temperature distribution occurs causing adhesion failures and warpage
Solution Approach 1:
The bonding head applies different thermal conditions to different regions of the die. The thermal pressurizer heats the bottom surface while thermal compensators heat the side surfaces, creating localized heating zones that collectively achieve uniform temperature distribution across the entire die structure.
Solution Approach 2:
The heating approach transitions from one-dimensional (bottom surface only) to three-dimensional heating by adding thermal compensators that heat the side surfaces. This multi-dimensional heating strategy ensures uniform temperature distribution throughout the die volume, preventing warpage and adhesion failures.
2Productivity
If external heat exposure is applied during die bonding, then bonding speed can be increased, but temperature distribution becomes non-uniform affecting adhesive film properties
Solution Approach 1:
The bonding head provides localized heating through thermal compensators positioned at specific regions (side surfaces) of the die. This targeted approach allows rapid heating without creating hot spots or non-uniform temperature distribution, maintaining adhesive film integrity while increasing bonding speed.
Solution Approach 2:
The thermal compensators act as intermediary heating elements between the external heat source and the die. They distribute heat uniformly across the side surfaces, mediating the heat transfer process to prevent direct external heat exposure that would cause non-uniform temperature distribution.
3Temperature
If thermal compensators with heat reflective surfaces are added to the bonding head, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
Rather than redesigning the entire bonding head, the solution adds localized thermal compensators with heat reflective surfaces at specific positions (side surfaces). This targeted modification achieves uniform temperature distribution with minimal impact on overall device complexity.
Solution Approach 2:
The thermal compensators utilize composite structures combining heat reflective surfaces with heating elements. This composite approach efficiently reflects and redistributes heat to achieve uniform temperature distribution while maintaining a compact design that doesn't significantly increase device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides uniform temperature distribution across the die, preventing adhesion failures and warpage by actively heating the die's side surfaces, thus ensuring consistent physical properties of the adhesive film during bonding.
Implementation Method 1
a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die
Implementation Method 2
a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a heat reflective surface that reflects heat from the die held on the thermal pressurizer
Implementation Method 3
having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer
Data Source
AI summary
A bonding head for a die bonding apparatus and a die bonding apparatus including the bonding head, the bonding head including a head body; a thermal pressurizer mounted on a lower surface of the head body, the thermal pressurizer being configured to hold and heat at least one die and including a heater having a first heating surface that faces a held surface of the die; and a thermal compensator at an outer region of the die, the thermal compensator extending downwardly from the lower surface of the head body and including at least one thermal compensating block having a second heating surface that emits heat from a heating source therein and that faces a side surface of the die held on the thermal pressurizer.