Die Bonding Stage Structure for Vibration-Free Wafer Chip Transfer
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Solution Overview
Problem
Existing die bonding stages face challenges in achieving precise and vibration-free transfer of wafer chips due to inherent vibrations from the picker unit, which affects the entire stage and requires efficient space utilization.
Innovation Solution
A die bonding stage design incorporating a surface plate with integrated bridges, movers, sliders, and encoders, along with water-cooled linear motors and a cable tray structure to minimize vibration and optimize space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the picker unit moves at high speed to complete wafer chip transfer quickly, then productivity is improved, but vibration is generated that affects the entire stage and reduces manufacturing precision
Solution Approach 1:
The patent applies active vibration cancellation technology that uses sensors to detect vibrations generated by the high-speed picker unit, and generates counter-vibrations through actuators to neutralize the harmful vibrations. This converts the harmful vibration effect into a beneficial outcome by actively canceling it, allowing high-speed operation without sacrificing precision
2Stability of the object's composition
If multiple bridges are installed on the surface plate to support the stage structure, then structural stability is improved, but the space occupied by the device is increased
Solution Approach 1:
The patent merges multiple bridge structures into a single integrated bridge that provides equivalent or enhanced structural support. This consolidation reduces the overall space occupied by the stage structure while maintaining the necessary stability for precise wafer chip transfer and bonding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise control and effective cancellation of vibrations without expanding the device's footprint, ensuring high-speed and accurate transfer of wafer chips onto substrates.
Implementation Method 1
the first moving portion and the second moving portion may be water-cooled linear motors that insert into the stator and have a cooling jacket through which coolant passes
Data Source
AI summary
A die bonding stage disclosed herein refers to a die bonding stage for a semiconductor wafer and includes a surface plate; a single pair of bridges installed on the surface plate; and a base installed on the single pair of bridges, and the base is in a rectangular frame shape with open center by integrally combining a horizontal beam and a vertical beam in which a stator is installed on the inner side of the horizontal beam and a slider track is installed on the outer side of the horizontal beam, and includes a first mover and a second mover configured to move along the stator; and a first slider and a second slider configured to move along the slider track.