Die Bonding Apparatus with Uniform Gas Pressurization
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Solution Overview
Problem
Die bonding processes often result in die damage due to force imbalances during the bonding process, as existing die bonding apparatuses may apply uneven pressure while pressing dies onto substrates.
Innovation Solution
A die bonding apparatus featuring a bonding member with a combination of mechanical and gas-based pressurizing mechanisms, including a bonding head with an adsorption hole, outer pressurizing grooves, and a pressurizing tube system to distribute gas pressure uniformly across the die, ensuring balanced force application during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a die bonding apparatus uses mechanical pressurization to bond dies to substrates, then bonding strength is improved, but force imbalance occurs causing die damage
Solution Approach 1:
The patent applies pneumatic pressurization by introducing gas between the bonding head and the die through multiple grooves (first grooves, second grooves, third grooves) to uniformly pressurize the die onto the substrate. This replaces or supplements mechanical pressurization, distributing force evenly across the die surface to prevent damage while achieving strong bonding.
Solution Approach 2:
The bonding head is segmented into multiple pressurization zones with separate gas supply grooves (first grooves for central region, second grooves for intermediate region, third grooves for outer region). This segmentation allows independent control of pressure in different regions, ensuring uniform force distribution and preventing die damage.
2Manufacturing precision
If gas pressure is used to pressurize the die, then uniform force distribution is improved, but device complexity increases due to additional grooves and gas supply systems
Solution Approach 1:
Multiple functions are merged into the bonding head structure: the first, second, and third grooves are integrated directly into the bonding head body, combining gas distribution channels with the pressurization function. The adsorption hole for picking up the die is also integrated into the same structure, reducing the need for separate components and minimizing overall device complexity.
Solution Approach 2:
The bonding head serves multiple functions: it picks up the die using the adsorption hole, distributes gas pressure through multiple groove systems, and provides mechanical support. This multi-functionality reduces the number of separate components needed, offsetting the increased complexity from the groove system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively mitigates or prevents die damage by applying consistent pressure, ensuring secure bonding while minimizing force imbalances and potential damage from uneven pressure distribution.
Implementation Method 1
a bonding head coupled to and disposed under the body, the bonding head having an adsorption hole configured to pick the die using a suction pressure
Implementation Method 2
outer pressurizing grooves outside the adsorption hole and outer pressurizing grooves outside the adsorption hole, the outer the outer pressurizing grooves providing a space, in which the gas pressurizing the picked-up die is received
Data Source
AI summary
The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.