Multi-Channel Pick-And-Placer Vacuum Release for Die Bonding
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Solution Overview
Problem
Current pick-and-place bonding technologies for SoIC packaging face challenges in controlling top die deformation during bonding, leading to inefficient plane-to-plane bonding due to the reliance on a single vacuum channel for top die handling.
Innovation Solution
Implementing a die bonding device with multiple vacuum channels and controlled time-on/off vacuum pumps to manage top die placement and release, ensuring smooth bonding wave propagation and eliminating vacuum bulge induced by non-smooth die contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single vacuum channel is used for top die handling, then the device complexity is reduced, but the manufacturing precision of top die placement deteriorates
Solution Approach 1:
The single vacuum channel is segmented into multiple independent vacuum channels (first vacuum channel, second vacuum channel, third vacuum channel), each capable of independent vacuum generation and release control. This segmentation allows precise control of top die placement and release, resolving the contradiction by improving placement precision while maintaining manageable device complexity through modular channel design.
2Ease of operation
If top die vacuum is controlled by a single parameter, then the ease of operation is improved, but the manufacturing precision of bonding deteriorates
Solution Approach 1:
The vacuum control system transitions from static single-parameter control to dynamic multi-parameter control, where each vacuum channel can be independently adjusted in terms of vacuum generation timing, vacuum level, and release timing. This dynamic control enables precise management of top die deformation during bonding while maintaining operational ease through automated control sequences.
3Device complexity
If vacuum release is not controlled by timing, then the device complexity is reduced, but the harmful factors during bonding increase
Solution Approach 1:
The system implements preliminary timed release of vacuum in the first vacuum channel before die bonding, which prevents vacuum bulge formation by gradually reducing vacuum pressure. This preliminary action approach resolves the contradiction by eliminating harmful vacuum bulge effects while maintaining manageable device complexity through sequenced vacuum release control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of multiple vacuum channels with precise timing control effectively manages top die deformation, enhancing bonding quality and eliminating vacuum bulge issues, thereby improving the yield and quality of the bonding process.
Implementation Method 1
a first vacuum pump and a second vacuum pump are respectively connected to a first channel and a second channel via pipelines, and the first vacuum pump and the second vacuum pump make the pick-and-placer adsorb the top die to an adsorption surface
Data Source
AI summary
A die bonding device is provided to pick up a die and place the die on a carrier. The die bonding device includes a pick-and-placer and a vacuum generator. The pick-and-placer includes an adsorption surface, a first channel and a second channel, and the first channel and the second channel are not connected to each other. The vacuum generator includes a first vacuum pump and a second vacuum pump, the first vacuum pump is connected to the first channel via a pipeline, the second vacuum pump is connected to the second channel via another pipeline, the first vacuum pump and the second vacuum pump make the pick-and-placer adsorb the die to the adsorption surface during a vacuum holding period, and the first vacuum pump and the second vacuum pump respectively make the pick-and-placer release the die to the carrier sequentially in a vacuum release period.