Semiconductor Die Bonding With Intermediate Vision Alignment
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Solution Overview
Problem
The existing die bonding processes face challenges with accuracy and throughput due to residual vibrations in bonding tools when moving semiconductor dies from wafers to substrates, leading to poor alignment and increased processing time.
Innovation Solution
An apparatus and method utilizing a gantry assembly with multiple bonding heads and vision assemblies for concurrent alignment and bonding of semiconductor devices, employing a feeder system and camera actuation to position and bond dies with high precision and speed, minimizing tool movement and vibrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the bonding tool moves significant distances between wafer and substrate, then the die can be picked and placed, but residual vibrations occur that reduce bonding accuracy
Solution Approach 1:
The patent introduces a vision assembly that moves vertically between the bonding tool and substrate to capture images from an intermediate position. This dimensional change allows alignment imaging without requiring the bonding tool to traverse the full distance between wafer and substrate, thereby reducing vibration-induced positioning errors while maintaining bonding capability
Solution Approach 2:
The vision assembly acts as an intermediary component that captures alignment images from an intermediate position between the bonding tool and substrate. This mediator enables accurate alignment imaging without requiring the bonding tool to move the full distance, thus reducing vibrations and improving bonding accuracy while maintaining throughput
2Productivity
If the bonding tool moves quickly between wafer and substrate, then throughput increases, but vibrations increase reducing alignment accuracy
Solution Approach 1:
The vision assembly operates from a vertical intermediate dimension rather than requiring horizontal movement of the bonding tool. This allows rapid image capture for alignment without the bonding tool traversing long distances, thereby maintaining high throughput while achieving accurate alignment through reduced vibration
Solution Approach 2:
The patent replaces the mechanical alignment approach (where the bonding tool physically moves and positions the die) with an optical alignment system. The vision assembly captures images and provides alignment data, substituting mechanical positioning with optical measurement to achieve both speed and precision
3Productivity
If vibration damping time is reduced, then throughput increases, but bonding accuracy deteriorates
Solution Approach 1:
The vision assembly captures alignment images from an intermediate position before the bonding tool completes its full movement to the substrate. This preliminary action allows alignment to be established early in the process, eliminating the need to wait for vibrations to subside before bonding, thus improving throughput without sacrificing precision
Solution Approach 2:
The vision assembly creates an optical copy or image of the substrate and die from an intermediate position. This copy allows alignment to be determined and corrections to be made before the bonding operation, eliminating the need to wait for vibration damping while maintaining bonding accuracy
Data Source
AI summary
An apparatus and method for semiconductor device (such as semiconductor die or die) bonding. The apparatus has a bonding assembly with a bonding head having a bonding tool for holding a semiconductor device; and a bonding head actuation mechanism for actuating the bonding tool horizontally planarly to align the semiconductor device relative to a bonding location of a substrate while the semiconductor device remains above the bonding location. The bonding assembly has a bonding assembly actuator for actuating the bonding head vertically to pick the semiconductor device and to bond the semiconductor device at the bonding location. The apparatus has a vision assembly with alignment cameras for capturing reference views of the semiconductor device and bonding location for aligning the semiconductor device relative to the bonding location, and a vision assembly actuation mechanism for actuating the alignment cameras to position the alignment cameras between the bonding tool and bonding location.