Semiconductor Die Bonding With Warpage Measurement and Tilt Alignment
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses face inefficiencies in accurately bonding semiconductor dies due to warpage and misalignment issues, leading to reduced yield and potential damage during the bonding process.
Innovation Solution
A semiconductor manufacturing apparatus equipped with sensors to measure warpage and optical elements for precise alignment, along with a tilt mechanism to level the stage and carrier, optimizes bonding parameters and ensures accurate die-to-carrier bonding by compensating for die shift and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional bonding apparatus is used, then the structure is simple, but the bonding precision deteriorates due to warpage and misalignment
Solution Approach 1:
The patent applies preliminary action by measuring the warpage of the semiconductor die before the bonding process using a sensor. This pre-measurement allows the system to calculate compensation values and adjust bonding parameters in advance, ensuring precise bonding despite the presence of warpage. The tilt mechanism is also activated before bonding to level the stage and carrier, further preparing the system to compensate for misalignment issues.
Solution Approach 2:
The patent implements feedback by using a sensor to detect the actual warpage of the semiconductor die and feed this information back to the control system. The control system then uses this feedback to calculate compensation values and adjust bonding parameters dynamically. The optical elements provide real-time alignment feedback, allowing the tilt mechanism to make continuous adjustments during the bonding process to maintain precision.
2Manufacturing precision
If warpage measurement and compensation are implemented, then bonding accuracy improves, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies self-service by implementing an automated warpage measurement and compensation system. The sensor automatically measures the die warpage, the control system automatically calculates compensation values, and the tilt mechanism automatically adjusts the stage and carrier alignment. This automated self-adjusting process eliminates the need for manual intervention, making the complex compensation process as easy to operate as traditional bonding while significantly improving bonding accuracy.
3Measurement precision
If optical elements and tilt mechanism are added, then alignment precision improves, but device complexity increases
Solution Approach 1:
The patent applies universality by designing the tilt mechanism to serve multiple functions: it levels the stage, aligns the carrier, and compensates for die shift during bonding. The optical elements are integrated into the existing apparatus structure, serving both as alignment measurement tools and as part of the overall positioning system. This multi-functional design reduces the need for separate dedicated components, thereby limiting the increase in overall apparatus complexity while achieving high alignment precision.
Data Source
AI summary
A method for forming a semiconductor device is provided. The method includes providing a wafer with multiple semiconductor dies on the adhesive film held by the frame element. The method also includes lifting a semiconductor die up from the wafer using an ejector element. The method includes picking up the semiconductor die with a collector element. The method further includes flip-chipping the semiconductor die with the collector element, and picking up the semiconductor die from the collector element using a bond-head element. In addition, the method includes measuring the warpage of the semiconductor die on the bond-head element using a sensor, then bonding the semiconductor die to a carrier using the bond-head element.