Die-Bridge Capacitor Package for Half-Bridge Ringing Reduction
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Solution Overview
Problem
Half-bridge circuits in power electronics experience ringing due to parasitic capacitances and inductances, which can lead to resonant peaks and increased power consumption, especially during transistor switching.
Innovation Solution
A capacitor is electrically connected between the input-voltage node and the reference-voltage node, with specific distances between the transistors and the capacitor to reduce parasitic effects, thereby minimizing ringing and improving switching speeds and power efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a decoupling capacitor is implemented to minimize ringing, then circuit stability is improved, but device complexity increases
Solution Approach 1:
The patent combines the decoupling capacitor with the leadframe structure by etching conductive paths directly into the leadframe segments. The capacitor is integrated between the input-voltage leadframe segment and reference-voltage leadframe segment, merging the capacitor function with the existing leadframe rather than adding a separate discrete component. This integration reduces device complexity while maintaining the stability-improving function of the decoupling capacitor.
2Stability of the object's composition
If package size is reduced to minimize ringing, then circuit stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes the vertical dimension by etching conductive paths through the thickness of the leadframe segments. The capacitor is formed by creating conductive paths that extend through the leadframe depth, allowing compact integration without increasing planar footprint. This dimensional approach enables small package size while managing manufacturing precision requirements through standardized etching processes.
3Use of energy by moving object
If transistor switching speed is increased to minimize ringing impact, then power efficiency is improved, but parasitic effects increase
Solution Approach 1:
The patent converts the harmful parasitic capacitances and inductances into a beneficial decoupling function. By strategically placing the decoupling capacitor with specific polarity connections (positive terminal to input-voltage leadframe segment, negative terminal to reference-voltage leadframe segment), the parasitic elements are transformed into a useful decoupling mechanism that suppresses ringing and improves power efficiency during transistor switching.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces parasitic influences, allowing for transistors with lower breakdown voltages and resistances, leading to improved performance and reduced power consumption while maintaining or enhancing circuit performance at high frequencies.
Implementation Method 1
Half-bridge circuits may include parasitic capacitances and parasitic inductances defined by the components and connections of the half-bridge circuit
Implementation Method 2
Half-bridge circuits may include parasitic capacitances and parasitic inductances defined by the components and connections of the half-bridge circuit
Data Source
AI summary
In some examples, a device comprises a first leadframe segment, a second leadframe segment, and a first transistor, wherein the first transistor is electrically connected to the first leadframe segment. The device further comprises a second transistor, wherein the second transistor is electrically connected to the second leadframe segment. The device further comprises a conductive element, wherein the conductive element is electrically connected to the first transistor and the second transistor. The device further comprises a capacitor, wherein a first end of the capacitor is electrically connected to the first leadframe segment and a second end of the capacitor is electrically connected to the second leadframe segment.