Semiconductor Die Carrier Hinge and Locking Structure for Clean Handling

Solution Overview

Problem

There is a need for containers that can securely store and transport semiconductor samples by providing a clean room climate, preventing physical damage, and protecting against external contamination and electrostatic charges.

Innovation Solution

The development of a semiconductor die carrier with a locking mechanism, partially-recessed pivotal pin structures, and polycarbonate composite materials that reduce chemical contamination and enhance electrical and mechanical properties, while also incorporating silicone pads and sponges for secure placement of semiconductor dies of various sizes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional containers are used for storing and transporting semiconductor samples, then basic storage function is provided, but the samples are vulnerable to physical damage, contamination, and electrostatic charges

Engineering Contradiction:

Improveprotection against physical damage and contaminationVSAvoidcontainer structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The container is divided into a body portion and a lid portion that can be separately assembled. The body portion includes a recessed region that receives the lid, creating interlocking engagement structures that enhance security without requiring complex integrated designs. This segmentation allows for easier manufacturing and assembly while providing robust protection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The container is formed from electrostatic discharge (ESD) safe materials that provide both mechanical protection and electrostatic protection. The use of composite or specially treated materials ensures that the container itself does not generate harmful electrostatic charges while maintaining structural integrity and contamination resistance.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If standard packaging materials are used, then basic storage is achieved, but chemical contamination cannot be prevented

Engineering Contradiction:

Improvechemical contamination protectionVSAvoidmanufacturing simplicity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The container is formed from electrostatic discharge (ESD) safe materials that provide both mechanical protection and electrostatic protection. The use of composite or specially treated materials ensures that the container itself does not generate harmful electrostatic charges while maintaining structural integrity and contamination resistance.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The container creates a controlled internal environment that protects semiconductor samples from chemical contamination. By using materials that do not outgas harmful chemicals and maintaining a stable internal atmosphere, the container prevents chemical degradation of sensitive semiconductor samples during storage and transport.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

3Reliability

If simple container designs are used, then manufacturing is easy, but secure locking mechanisms are lacking

Engineering Contradiction:

Improvelocking mechanism securityVSAvoidlocking mechanism complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The container is divided into a body portion and a lid portion that can be separately assembled. The body portion includes a recessed region that receives the lid, creating interlocking engagement structures that enhance security without requiring complex integrated designs. This segmentation allows for easier manufacturing and assembly while providing robust protection.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The container includes pre-formed engagement structures such as recesses, protrusions, and locking features that are integrated into the container walls during manufacturing. These preliminary structures enable secure locking when the lid is placed on the body, eliminating the need for additional complex locking mechanisms while ensuring reliable closure.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS12322623B2Semiconductor die carrier structure

Publication Date: 2025.06.03 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.