Die Carrier Corner Relief Undercut for Die Chip-Out Prevention

The patent applies asymmetry by using different undercut configurations at different corners of the die carrier. Specifically, opposite corners have undercuts while adjacent corners have different undercut depths or orientations. This asymmetric design prevents symmetric chip-out failure modes while maintaining die placement restriction, as the die cannot be misaligned in any direction without encountering an undercut feature.

The patent implements local quality by varying the undercut characteristics at different corner locations. Each corner area has customized undercut geometry tailored to its specific stress and alignment requirements. This localized optimization prevents chip-out at vulnerable corners while maintaining overall die stability, addressing the specific problem of corner chip-out without over-constraining the entire die structure.

The patent applies parameter changes by varying the undercut depth, angle, and orientation at different corners rather than using a uniform deep undercut design. This allows optimization of protection levels at each corner based on its specific geometry and stress conditions, preventing chip-out while maintaining adequate die placement movement for manual insertion.

The patent uses partial action by implementing undercuts at only certain corners rather than all corners, and using different undercut intensities at different locations. This partial application of the undercut feature provides sufficient corner protection where needed while avoiding excessive movement restriction that would result from uniform deep undercuts at all corners.