Semiconductor Die Carrier With Pivot Locking and ESD Control

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Solution Overview

Problem

Semiconductor samples require containers that provide a clean room climate for storage and transportation to prevent physical damage, contamination, and electrostatic charges, while also ensuring secure holding and easy identification during processing in integrated circuit fabrication facilities.

Innovation Solution

A semiconductor die carrier with a locking mechanism, partially-recessed pivotal pin structures, and polycarbonate composite materials that reduce contamination and electrostatic interference, along with imprinted barcodes for identification, and silicone pads for secure placement of semiconductor dies, facilitating easy cleaning and varying sizes accommodation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If semiconductor samples are packed in a container for storage and transportation, then physical damage and contamination are prevented, but the device complexity increases due to the need for specialized container structures

Engineering Contradiction:

Improveprotection against physical damage and contaminationVSAvoidcontainer structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The container is divided into a body portion and a lid portion that can be separately assembled and disassembled. The body portion includes a recessed region that receives the lid, creating a modular structure that simplifies manufacturing while providing secure sealing when assembled.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The lid portion is nested within the body portion through the recessed region, creating a compact integrated structure. This nesting arrangement reduces overall complexity by having one component fit into another rather than requiring separate mounting features.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

If a locking mechanism is added to secure the lid to the body, then secure holding is improved, but device complexity increases

Engineering Contradiction:

Improvesecure holding of semiconductor samplesVSAvoidlocking mechanism complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The locking feature is merged into the lid portion itself through an integrally formed protrusion that engages with the body portion. This eliminates the need for separate locking components while providing secure attachment through the interlocking geometry of the protrusion and recessed region.

Inventive Principle:

Principle #5Merging (Combining)

3Object-affected harmful factors

If polycarbonate composite materials are used, then electrostatic interference and contamination are reduced, but manufacturing precision requirements increase

Engineering Contradiction:

Improveelectrostatic interference and contaminationVSAvoidmaterial fabrication precision

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

Polycarbonate composite material is used for both the body and lid portions, providing inherent electrostatic dissipation properties and resistance to contamination. The composite nature of the material integrates multiple functional properties into a single material system, reducing the need for additional protective layers or treatments.

Inventive Principle:

Principle #40Composite materials

4Reliability

If silicone pads are added for secure placement, then holding security is improved, but device complexity increases

Engineering Contradiction:

Improvesecure placement of semiconductor diesVSAvoidcarrier structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Silicone pads are used as simple, replaceable elements for securing semiconductor dies. These pads can be easily replaced if worn or contaminated, and their simple geometry requires minimal manufacturing precision while providing effective cushioning and secure placement through their elastic properties.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The semiconductor die carrier effectively prevents physical damage and contamination, ensures secure storage and easy identification, and maintains high electrical and mechanical properties, enhancing the reliability of semiconductor samples during transportation and processing.

Implementation Method 1

polycarbonate composite materials that reduce contamination and electrostatic interference

Methodology Applied

Scientific EffectElectrostatic dissipation: Electrostatics

Data Source

PatentUS11881421B2Semiconductor die carrier structure

Publication Date: 2024.01.23 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An apparatus having a first portion including a first front wall, a first rear wall, and a bottom wall integrally coupled to the first front wall and the first rear wall, and pivotal pin structures integrally coupled to and extending from the first rear wall. The apparatus includes a second portion having a second front wall, a second rear wall, and a top wall integrally coupled to the second front wall and the second rear wall, and pin holders integrally coupled to and extending from the second rear wall and at an offset angle with reference to the top wall. The pivotal pin structure includes a base support connected to the first rear wall and a shaft connected to the base support, and the pin holder defines an opening sized and shaped to accept the shaft. The first and second portions are sized and shaped to be pivotally movable between open and closed configurations.