Configurable Die Carrier Using Hydrophilic Self-Alignment

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for transferring integrated circuit (IC) devices using pick and place tools often result in surface residue and damage, and require additional processing steps due to the use of protective films, which complicate the manufacturing process.

Innovation Solution

A reprogrammable carrier with hydrophilic and hydrophobic zones is used for self-aligning die transfer, eliminating the need for mechanical vacuum tips and reducing residue and damage by utilizing liquid beads to attract and repel on these zones.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If pick and place tools with vacuum tips are used to transfer IC devices, then transfer capability is achieved, but organic residue is left on the die surface and possible damage occurs

Engineering Contradiction:

Improvetransfer capabilityVSAvoidsurface residue and damage

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical vacuum tip system with a liquid-based transfer mechanism. Liquid beads are deposited on the carrier wafer surface, and IC devices are transferred through liquid bridge formation and capillary forces, eliminating contact with vacuum tips that leave organic residue.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses liquid beads and liquid bridges to enable die transfer. The liquid medium creates capillary forces and surface tension effects that facilitate pickup and placement without mechanical contact, replacing the pneumatic vacuum system with a hydraulic/liquid-based system.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If protective films are applied to prevent damage and residue, then die protection is improved, but manufacturing process complexity increases and additional heating steps are required

Engineering Contradiction:

Improvedie protectionVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The liquid beads on the carrier wafer surface provide a protective cushioning layer before die transfer. This liquid medium prevents direct mechanical contact and potential damage, eliminating the need for separate protective films while maintaining die protection.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The liquid beads act as an intermediary medium between the carrier wafer and IC devices during transfer. This liquid mediator enables damage-free handling without requiring additional protective film layers, simplifying the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of operation

If protective films are removed prior to hybrid bonding, then bonding surface access is achieved, but residue is added, copper surfaces are oxidized or etched, and additional heating is required

Engineering Contradiction:

Improvebonding surface accessVSAvoidsurface oxidation and residue

Core Design Contradiction:

Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the protective function from separate film layers and integrates it into the liquid transfer medium itself. The liquid beads provide protection during transfer, and their removal leaves no residue that would require additional cleaning or cause oxidation, enabling direct bonding surface access.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient, residue-free, and damage-free transfer of IC devices, simplifying the manufacturing process and avoiding the need for additional cleaning or protective film steps.

Implementation Method 1

A liquid on a surface of the carrier is attracted to the hydrophilic zones and repelled from the hydrophobic zones. Die transfer is accomplished in a self-aligning manner by beads of liquid on the surface of the carrier being attracted to hydrophilic zones.

Methodology Applied

Scientific EffectCapillary action: Capillary Action

Implementation Method 2

Methodology Applied

Scientific EffectSurface tension: Surface Tension

Implementation Method 3

Methodology Applied

Scientific EffectHydrophobic effect: Hydrophobe

Data Source

PatentUS20250218847A1Configurable carrier for transfer and self-assembly of multiple integrated circuit devices

Publication Date: 2025.07.03 INTEL CORP

AI summary

A first carrier comprises a plurality of regions. Each region comprises a first zone and a second zone. The second zone comprises a portion that surrounds the first zone. Each first zone comprises a hydrophilic surface, and each second zone comprises a hydrophobic surface. A first liquid is deposited on the first carrier. The plurality of regions are aligned with a plurality of dies on a second carrier. The dies are transferred from the second carrier to the first carrier. A second liquid is deposited on a substrate, which includes a plurality of bond areas. Each die bond area comprises a hydrophilic surface. The dies are transferred from the first carrier to the substrate.