Semiconductor Die Carrier Tape Protrusions to Prevent Die Shifting
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Solution Overview
Problem
Semiconductor dies experience 'die shifting' during packaging and transportation due to concave bending and vibration in carrier tapes, leading to damage and processing errors in automated assembly systems.
Innovation Solution
Modified carrier tapes with protrusions or bumps on the cover tape are used to secure semiconductor dies within their pockets, preventing shifting and displacement by adjusting the spacing and dimensions of the protrusions to accommodate various die sizes and shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor dies are placed in recesses of a carrier tape for transportation, then the dies are protected during handling, but the carrier tape experiences concave bending and vibration causing die shifting within the pockets
Solution Approach 1:
The patent applies preliminary anti-action by adding protrusions or bumps to the carrier tape pockets before the die shifting problem occurs. These protrusions create preliminary resistance against the concave bending and vibration forces that would otherwise cause die shifting, thereby preventing the harmful effect before it can manifest.
Solution Approach 2:
The patent applies local quality by modifying specific regions of the carrier tape pockets with protrusions or bumps at strategic locations. Rather than changing the entire carrier tape structure, only the critical areas where dies are most susceptible to shifting are enhanced with additional protective features, allowing localized improvement of die position stability.
2Reliability
If the carrier tape is sealed to protect semiconductor dies, then transportation safety is improved, but the sealed carrier tape experiences vibration causing die shifting and potential damage
Solution Approach 1:
The patent applies parameter changes by modifying the physical parameters of the carrier tape pockets through the addition of protrusions or bumps. This changes the mechanical interaction between the pocket and the die, increasing friction and mechanical interlocking to resist vibration-induced shifting while maintaining the sealed protective environment.
3Stability of the object's composition
If semiconductor dies are secured tightly in carrier pockets to prevent shifting, then die position stability is improved, but the complexity of the carrier tape structure increases
Solution Approach 1:
The patent applies local quality by adding protrusions or bumps only at specific critical locations within the carrier tape pockets rather than throughout the entire structure. This localized modification provides the necessary die position stability while minimizing the increase in overall structural complexity.
Data Source
AI summary
An apparatus for transporting a plurality of semiconductor dies comprises a first tape having a top side and a bottom side opposite of the top side, the top side including a plurality of protrusions, wherein subsets of the plurality of protrusions are grouped together and each subset is spaced apart from adjacent subsets at a predetermined interval; and a second tape having a front side and a back side opposite of the front side, the front side including a plurality of pockets, each of the plurality of pockets configured for receiving a semiconductor die, wherein each of the plurality of pockets is spaced apart from adjacent pocket at the predetermined interval. The subsets of the plurality of protrusions are configured to vertically align with the plurality of pockets.