Semiconductor Die Carrier Handling for Warpage-Free Packaging
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Solution Overview
Problem
The increasing thinness and width of semiconductor dies lead to warpage issues during handling, and the use of copper-SiO2 hybrid bonding technology exposes metal pads, making existing pick and place methods risky for damage.
Innovation Solution
A semiconductor package manufacturing method that involves bonding a carrier to a wafer, dicing them together into die-carrier assemblies, disposing these assemblies on a target substrate, and separating the carrier pieces by irradiating with light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the die becomes thinner to achieve low power and high performance, then power consumption is reduced and performance is improved, but warpage increases causing handling problems
Solution Approach 1:
A carrier is introduced as an intermediary substrate to support the thin die during handling and packaging processes. The carrier provides mechanical stability and prevents warpage by distributing stresses, enabling the thin die to be handled without deformation while maintaining its low-power, high-performance characteristics
Solution Approach 2:
The carrier is bonded to the die before dicing and handling operations. This preliminary support structure is established in advance to prevent warpage from occurring during subsequent processing steps, rather than attempting to correct warpage after it develops
2Productivity
If copper-SiO2 hybrid bonding technology is used to increase input/output density, then I/O density is improved, but the risk of die damage increases due to exposed metal pads
Solution Approach 1:
The carrier serves as a protective intermediary that covers and shields the exposed metal pads on the die during handling and packaging. This prevents direct contact between the fragile metal pads and external objects, reducing the risk of damage while enabling the use of high-density copper-SiO2 hybrid bonding
Solution Approach 2:
The carrier provides protective coverage over the metal pads before any handling or bonding operations occur. This pre-established protection cushions the vulnerable areas against mechanical damage during the packaging process
3Ease of manufacture
If existing pick and place methods are used for thin die handling, then standard manufacturing processes are maintained, but the risk of die damage increases
Solution Approach 1:
The carrier acts as a robust intermediary handle that enables standard pick and place equipment to grip and manipulate the die-carrier assembly safely. The carrier distributes mechanical stresses away from the thin die, allowing conventional manufacturing methods to be used without increasing damage risk
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method facilitates the easy handling of ultra-thin dies by preventing warpage and simplifying the packaging process, while also ensuring the safety of the dies during handling.
Implementation Method 1
separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light
Data Source
AI summary
A semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.