Semiconductor Die Cavities and Etched Notches for Crack-Free Singulation
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Solution Overview
Problem
Conventional semiconductor package manufacturing methods, such as sawing, result in chips and cracks on the die surface, compromising package reliability and limiting the production of non-rectangular die shapes.
Innovation Solution
The method involves forming notches on the semiconductor substrate using etching techniques, applying an organic material and backmetal, and singulating the substrate into packages, which reduces the occurrence of cracks and allows for the production of non-rectangular die shapes by anchoring the mold compound to the substrate ridges, enhancing package reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sawing is used to singulate semiconductor substrates, then productivity is improved, but manufacturing precision deteriorates due to chips and cracks on the die surface
Solution Approach 1:
The patent replaces the mechanical sawing process with a chemical etching process to singulate the semiconductor substrate. This substitution eliminates the mechanical contact that causes chips and cracks, thereby improving die surface quality while maintaining production efficiency through the chemical separation method
Solution Approach 2:
The patent changes the physical-chemical parameters of the substrate by forming cavities and applying organic materials that modify the etching behavior. These parameter changes enable precise control of the singulation process, achieving clean separation without mechanical damage to the die surface
2Ease of manufacture
If conventional singulation methods are used, then manufacturing simplicity is maintained, but reliability deteriorates due to cracks and chips compromising package integrity
Solution Approach 1:
The patent performs preliminary actions by forming notches, applying organic material, and creating cavities in the substrate before the final singulation step. These preliminary modifications to the substrate structure enable crack-free separation and improve package reliability without significantly complicating the overall manufacturing process
Solution Approach 2:
The patent introduces an organic material as an intermediary substance that facilitates the singulation process. This material is applied to the substrate and interacts with the etching process to enable clean separation, acting as a mediator between the chemical etching and the die structure to prevent cracks and chips
3Manufacturing precision
If rectangular die shapes are produced using conventional methods, then manufacturing precision is maintained, but adaptability deteriorates by limiting non-rectangular die shapes
Solution Approach 1:
The patent segments the substrate into multiple notches that can be configured in various patterns. By controlling the arrangement, depth, and configuration of these notches, the method enables production of different die shapes including non-rectangular forms while maintaining precise dimensional control through the etching process
Solution Approach 2:
The patent employs asymmetric notch configurations and cavity placements that allow for non-rectangular die shapes. By varying the symmetry and arrangement of features on the substrate, the method achieves dimensional accuracy for diverse geometries, breaking the limitation of only rectangular die production
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability of semiconductor packages by eliminating cracks and chips, enabling the production of packages with non-rectangular die shapes and reducing warpage, thus enhancing the processing and functionality of semiconductor devices.
Implementation Method 1
anchoring the mold compound to the substrate ridges
Implementation Method 2
forming notches on the semiconductor substrate using etching techniques; forming a cavity into each of a plurality of semiconductor die
Data Source
AI summary
Implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and into the plurality of notches; forming a cavity into each of a plurality of semiconductor die included in the semiconductor substrate; applying a backmetal into the cavity in each of the plurality of semiconductor die included in the semiconductor substrate; and singulating the semiconductor substrate through the organic material into a plurality of semiconductor packages.