Package Substrate Die Cavity Layout for Decoupled Fan-Out Packaging
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Solution Overview
Problem
The high cost and inefficiency of the pick-and-place process in manufacturing fan-out semiconductor packages, where semiconductor dies are placed on a carrier, limit the utilization of manufacturing facilities and increase production costs due to the need for carriers and adhesive degradation.
Innovation Solution
Forming a redistribution layer on a dummy wafer before placing semiconductor dies within cavities in a substrate, allowing the pick-and-place and molding processes to be decoupled from redistribution layer formation, thereby optimizing facility use and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pick-and-place process is used to position semiconductor dies on a carrier, then the semiconductor dies can be accurately positioned, but the manufacturing cost increases and facility utilization decreases
Solution Approach 1:
The redistribution layer is formed on a dummy wafer before the pick-and-place process, preparing the substrate in advance. This preliminary action allows the dummy wafer to serve as the final substrate, eliminating the need for a separate carrier and enabling the pick-and-place and molding processes to be performed independently of redistribution layer formation, thereby improving facility utilization
Solution Approach 2:
The carrier is removed from the manufacturing process by using the dummy wafer as the final substrate. The redistribution layer formation process is extracted and performed independently on the dummy wafer before die placement, eliminating the bottleneck where facility resources were tied up during pick-and-place operations
2Manufacturing precision
If the pick-and-place process is used for die placement, then the dies can be precisely positioned, but production costs increase due to carrier requirements and adhesive degradation
Solution Approach 1:
The carrier and adhesive materials are removed from the process by using the dummy wafer as the final substrate. The dummy wafer provides a stable base for die placement without requiring additional carriers or adhesive materials, thereby reducing material costs and simplifying the manufacturing process
Solution Approach 2:
The dummy wafer serves as a disposable substrate that is used specifically for the pick-and-place process and then discarded after the dies are transferred to the final substrate. This eliminates the need for expensive, reusable carriers and reduces the cost of adhesive materials
Data Source
AI summary
A semiconductor package includes a semiconductor substrate forming a cavity and a redistribution layer on a first side of the semiconductor substrate, the redistribution layer forming die contacts within the cavity and a set of terminals for the semiconductor package opposite the semiconductor substrate. The redistribution layer electrically connects one or more of the die contacts to the set of terminals. The semiconductor package further includes a semiconductor die including die terminals within the cavity with the die terminals electrically coupled to the die contacts within the cavity.