Die Cleaning Frame Structure for Contamination-Free Die Bonding
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Solution Overview
Problem
Conventional methods for positioning singulated devices in die-to-wafer bonding processes suffer from high defectivity due to contamination and misalignment, particularly for larger dies, leading to reduced yield and increased manufacturing costs.
Innovation Solution
The use of die cleaning frames with protuberances and resilient members to support singulated devices, minimizing contact with active sides and facilitating pick and place bonding without direct contact, and enabling transfer between carriers without surface contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to position singulated devices, then the bonding process can be completed, but high defectivity occurs due to contamination transferred between devices and handling apparatus
Solution Approach 1:
The patent introduces a carrier with a die pocket region as an intermediary between the handling apparatus and the singulated device. The die pocket region receives and holds the device during processing, allowing the handling apparatus to interact with the carrier rather than directly with the device surface. This mediator prevents contamination transfer while maintaining secure positioning and enabling complete bonding processes.
2Ease of operation
If multiple handoffs are used to position devices face down, then positioning can be achieved, but larger dies are prone to breakage from stress-induced micro-cracks
Solution Approach 1:
The carrier is pre-configured with a die pocket region designed to receive and securely hold the singulated device in the desired face-down orientation before bonding. This preliminary positioning eliminates the need for multiple subsequent handoffs and repositioning operations, thereby preventing stress-induced micro-cracks in larger, more fragile dies while maintaining ease of operation.
3Productivity
If devices are handled extensively during processing, then all processing steps can be completed, but manufacturing costs increase due to reduced yield
Solution Approach 1:
The patent combines multiple processing functions into a single carrier system. The carrier not only positions the device but also protects it during cleaning, preparation, and bonding operations. This integrated approach allows all necessary processing steps to be completed on a single device within the carrier, reducing handling次数 and minimizing yield loss from repeated manipulation, thereby improving manufacturing yield while maintaining processing completeness.
Data Source
AI summary
Embodiments herein are generally directed to die cleaning frames for processing and handling singulated devices and methods related thereto. The die cleaning frames may be used advantageously to minimize contact with device surfaces during post-singulation processing and to facilitate a pick and place bonding process without touching the active side of the cleaned device. Thus, the die cleaning frames and methods described herein eliminate the need for undesirable contact with clean and prepared active sides of the devices during a direct placement die-to-wafer bonding process. In one embodiment, a carrier configured to support a singulated device in a die pocket region may include a carrier plate and a frame that surrounds the carrier plate and is integrally formed therewith. The carrier plate may include a first surface and an opposite second surface, and one or more sidewalls that define an opening disposed through and extending between the first and second surfaces. Each of the sidewalls may include one or more protuberances that collectively determine a rectangular boundary of the die pocket region. Some of the protuberances may include a die supporting surface that extends beneath the die pocket region.