Semiconductor Die Clip Layout for Dual-Side Cooling
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Solution Overview
Problem
The reduction in size of semiconductor dies due to advancements in semiconductor technology limits the space available for soldering or sintering clips, which in turn reduces the area for top-side cooling of the package, particularly when accommodating gate bond wires or current sense bond wires.
Innovation Solution
A semiconductor device design that includes a semiconductor die with contact pads on both main faces, a clip connected to one of the contact pads, and a wire disposed at least partially under the clip, with an insulation layer or insulator body to prevent electrical contact between the wire and the clip, allowing for a larger clip to be placed over the die for efficient dual-side cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor die size is reduced to improve integration density, then the area for top-side cooling is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from single-sided cooling to dual-sided cooling by extending the cooling function to both main faces of the semiconductor die. This dimensional expansion allows heat dissipation from both sides of the die, effectively doubling the cooling area and resolving the heat dissipation limitation imposed by reduced die size.
2Device complexity
If the clip size is reduced to accommodate bond wires, then the area for top-side cooling is reduced, but the heat dissipation capability deteriorates
Solution Approach 1:
The cooling function is extended from single-sided to dual-sided by utilizing both main faces of the semiconductor die for heat dissipation. This allows the clip to maintain its wire-accommodating function while the overall heat dissipation capability is preserved through the additional cooling surface area on the opposite side of the die.
3Reliability
If the wire is placed under the clip, then the electrical isolation is improved, but the manufacturing complexity increases
Solution Approach 1:
The wire is positioned under the clip during the assembly process before final packaging. This preliminary positioning ensures proper electrical isolation is achieved from the outset, and the subsequent packaging step simply encloses the already-configured components, maintaining manufacturing simplicity while ensuring reliability.
Data Source
AI summary
A method for fabricating a semiconductor device includes: providing a carrier; providing first and second external contacts; providing a semiconductor die including a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, and a vertical transistor; disposing the semiconductor die with the first main face onto the carrier; connecting a wire with the second external contact; and connecting a clip between the second contact pad and the first external contact. Connecting the wire is carried out before connecting the clip.