Semiconductor Die Clip-Frame Assembly for Faster Lead Attachment
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Solution Overview
Problem
Existing methods for packaging semiconductor integrated circuits are complex, costly, and prone to defects, particularly when attaching leads to the second surface of the die.
Innovation Solution
A method where multiple dies are attached to a lead-frame strip on one side and a clip-frame strip on the other side, allowing for simultaneous attachment of leads to both surfaces, reducing complexity and increasing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If individual clips are placed on the second sides of multiple dies one at a time, then the attachment can be completed, but the process becomes complex, costly, and time-consuming
Solution Approach 1:
The patent merges multiple individual clip attachment operations into a single simultaneous operation by using a clip-frame strip that holds multiple clips in predetermined positions. The clip-frame strip is attached to the lead frame with all clips positioned over corresponding dies, allowing all second-side attachments to occur simultaneously rather than sequentially. This resolving the contradiction by combining multiple steps into one, achieving both simplicity and high productivity.
Solution Approach 2:
The patent applies preliminary action by pre-positioning multiple clips on the clip-frame strip in predetermined locations before the attachment process begins. The clips are already aligned with their corresponding dies on the lead frame, eliminating the need for individual positioning during the attachment operation. This pre-positioning enables simultaneous attachment of all clips, resolving the contradiction between process simplicity and attachment speed.
2Productivity
If multiple clips are attached simultaneously using a clip-frame strip, then productivity increases and costs decrease, but alignment precision must be maintained
Solution Approach 1:
The patent introduces the clip-frame strip as an intermediary element that mediates between the clips and the dies. The clip-frame strip serves as a carrier that maintains precise spacing and alignment between multiple clips and their corresponding dies on the lead frame. This intermediary structure enables simultaneous attachment while preserving alignment accuracy, resolving the contradiction between high productivity and manufacturing precision.
Solution Approach 2:
The patent segments the attachment process into two independent stages: first, attaching the lead frame with dies to the paddle; second, attaching the pre-assembled clip-frame strip with multiple clips to the second sides of the dies. This segmentation allows each stage to be optimized independently, with the clip-frame strip ensuring precise alignment during the second stage while enabling simultaneous attachment of multiple clips, thus resolving the contradiction between productivity and precision.
3Device complexity
If leads are attached to both surfaces of the die simultaneously, then the manufacturing process is simplified, but the complexity of coordinating both attachments increases
Solution Approach 1:
The patent merges the attachment of multiple clips to the second sides of dies into a single simultaneous operation using the clip-frame strip. By combining what would otherwise be multiple individual attachment steps into one operation, the overall process complexity is reduced while enabling both surfaces of the dies to be attached simultaneously. This resolves the contradiction by showing that coordinated simultaneous attachment actually simplifies the manufacturing process.
Data Source
AI summary
A method for assembling a chip includes attaching a first side of each die of multiple dies to a respective at least one paddle of multiple paddles of a lead-frame strip, and attaching each of at least one paddle of multiple paddles of a clip-frame strip to a second side of the respective die of the multiple dies. As compared to a semiconductor-packaging method that places individual clips on the second sides of multiple dies one at a time, such a method can be less expensive, less complex, faster, have a higher yield, and/or can reduce the per-component cost of integrated circuits (ICs) and/or other components packaged according to this method.