Die Component Supply Device with Imaging for Quality Traceability
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Solution Overview
Problem
The existing die component supply devices face issues with quality degradation during component pickup due to uneven component holding sheets, leading to potential chipping and misrecognition, and lack sufficient traceability to identify issues in mounted boards.
Innovation Solution
A die component supply device that records and quantifies the state of each die component using imaging cameras and data processing, storing component image and characteristic data in wafer characteristic data for later analysis, enabling traceability and improved handling method analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a suction nozzle picks up die components from an expanded component holding sheet, then die components can be transferred to boards, but quality decreases due to rubbing against adjacent components causing chipping
Solution Approach 1:
The system performs preliminary imaging of die components before pickup to record their initial positions and states. This advance recording allows the system to track component locations and detect any quality issues or positional changes that occur during the pickup and transfer process, preventing chipping by enabling corrective actions before damage occurs.
Solution Approach 2:
The system implements feedback by continuously imaging die components at multiple stages (before pickup, during transfer, and after mounting) and comparing their positions and states. This feedback mechanism allows real-time detection of rubbing, chipping, or misalignment, enabling the system to adjust pickup forces, transfer speeds, or positioning to prevent quality degradation.
2Ease of manufacture
If the component holding sheet is in an uneven expanded state, then die components can be held on the sheet, but misrecognition of die components occurs
Solution Approach 1:
The system performs preliminary imaging of the component holding sheet and die components before pickup to record their initial positions and states. This advance recording captures the uneven expanded state of the sheet, allowing the system to compensate for positional variations during pickup and prevent misrecognition by adjusting coordinate transformations based on the recorded sheet state.
3Productivity
If die components are picked up in order from an edge in a two-dimensional lattice arrangement, then systematic transfer can be achieved, but positions of remaining die components slightly change causing misrecognition
Solution Approach 1:
The system performs preliminary imaging of all die components in the two-dimensional lattice arrangement before pickup begins. This records the initial positions of all components, allowing the system to track and compensate for positional changes of remaining components as pickup progresses, preventing misrecognition while maintaining systematic transfer efficiency.
Solution Approach 2:
The system implements feedback by imaging die components at multiple stages and comparing their positions against the preliminary record. This allows real-time detection of positional changes in remaining components during the ordered pickup process, enabling the system to adjust positioning and prevent misrecognition while maintaining systematic transfer.
4Productivity
If component holding sheet extends and hangs down after many die components are picked up, then pickup process can continue, but remaining die components interfere with each other decreasing quality
Solution Approach 1:
The system implements feedback by imaging the component holding sheet and remaining die components at multiple stages during the pickup process. This allows real-time detection of sheet extension and hanging down, enabling the system to adjust pickup timing, modify sheet tension, or reposition components to prevent interference and maintain quality throughout continuous operation.
Data Source
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Figure 3~4
Figure 5
AI summary
A die component supply device (1) includes: a wafer holding section (2) that includes an elastic component holding sheet (23) configured to hold multiple die components (D) formed by dicing a semiconductor wafer on an upper face and a support ring (22) configured to support a peripheral edge of the component holding sheet; a suction nozzle (5) configured to pick up the die components one by one from the component holding sheet; an imaging camera (6) configured to image the die component, which is a pickup target of the suction nozzle (5), together with the surrounding condition, before being picked up to obtain component image data; a driving section (4) configured to move the suction nozzle and the imaging camera with respect to the wafer holding section; and a data processing memory section (87) configured to collectively store multiple pieces of component image data obtained for each multiple die component or multiple pieces of component characteristic data obtained by performing image processing on the multiple pieces of component image data in wafer characteristic data (88).