Taper-Shaped Die Connectors for Bubble-Free Semiconductor Packaging
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Solution Overview
Problem
The formation of bubbles during the packaging process of semiconductor components due to the use of high-viscosity polymers and vertical conductive connectors, which can damage the package, is a challenge in the semiconductor industry.
Innovation Solution
The use of taper-shaped conductive connectors and die connectors to prevent bubble formation by allowing polymers to fill the spaces between connectors without obstruction, achieved through specific etching processes to create a tapered profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical conductive connectors are used during packaging, then manufacturing simplicity is maintained, but bubbles form during encapsulation damaging the package
Solution Approach 1:
The conductive connector is changed from a vertical cylindrical shape to an asymmetric tapered shape with a larger top surface area than bottom surface area. This asymmetric geometry allows the high-viscosity polymer to flow around the connector during encapsulation without trapping bubbles, while the connector still provides effective electrical connection between dies.
Solution Approach 2:
The geometry parameters of the conductive connector are modified by creating a tapered profile with specific angle ranges (30-60 degrees). This parameter change in the connector shape fundamentally alters the fluid dynamics of polymer filling, preventing bubble entrapment while maintaining electrical functionality.
2Strength
If high-viscosity polymers are used for encapsulation, then structural support is improved, but bubble formation occurs around vertical connectors
Solution Approach 1:
The tapered asymmetric shape of the conductive connector creates a flow path that accommodates high-viscosity polymer material. The larger top surface area provides sufficient space for the viscous polymer to flow around the connector without trapping air bubbles, while still providing the necessary structural support during encapsulation.
3Reliability
If taper-shaped connectors are used to prevent bubbles, then package reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The connector geometry is modified by changing only the shape parameters (taper angle, top and bottom surface areas) while maintaining the basic conductive connector structure and function. This parameter change achieves bubble-free encapsulation without fundamentally redesigning the entire packaging system.
Data Source
AI summary
Provided is a package structure including a first die and an encapsulant. The first die includes a substrate, a plurality of pads over the substrate, a passivation layer on portions of each of the plurality of pads, a plurality of first die connectors on the plurality of pads, respectively and a dielectric layer laterally encapsulating the plurality of first die connectors. The encapsulant laterally encapsulates the first die. One of the plurality of first die connectors is a taper-shaped die connector. A width of the one of the plurality of first die connectors gradually increases from a top surface of the one of the plurality of first die connectors toward the a top surface of the passivation layer.