Semiconductor Die Contact Packaging With Etched Notches
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Solution Overview
Problem
Existing semiconductor package manufacturing methods, particularly sawing techniques, lead to chipping and cracking of semiconductor dies, compromising their reliability and limiting the ability to produce non-rectangular die shapes.
Innovation Solution
Employing etching techniques to form notches in semiconductor wafers, which reduces the occurrence of cracks and chips, allowing for more reliable and varied die shapes, and using a mold compound to anchor and protect the die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sawing techniques are used to separate semiconductor dies, then manufacturing efficiency is improved, but chipping and cracking of semiconductor dies occurs
Solution Approach 1:
The patent replaces the mechanical sawing process with a chemical etching process. Instead of using physical saw blades to separate the semiconductor wafer into individual dies, the invention uses etching chemistry to selectively remove material and create separation structures. This substitution eliminates the mechanical contact that causes chipping and cracking while maintaining the ability to separate dies efficiently.
Solution Approach 2:
The patent introduces an intermediary etching process between the wafer fabrication and die separation steps. This intermediary step uses chemical etchants to create notches and separation structures that facilitate clean die release without direct mechanical contact. The etching process acts as a mediator that enables subsequent die separation while protecting the die edges from damage.
2Ease of manufacture
If traditional sawing methods are used, then manufacturing process is simple, but non-rectangular die shapes cannot be produced
Solution Approach 1:
The patent changes the fundamental parameter of the separation process from mechanical cutting to chemical etching. This parameter change enables the creation of complex, non-rectangular die shapes that cannot be achieved with traditional sawing. The etching process can be selectively applied to create various geometries while maintaining process control and manufacturing simplicity.
Solution Approach 2:
The patent applies etching selectively to different regions of the semiconductor wafer to create local variations in shape. By controlling the etching process parameters and masking patterns, the invention can create non-rectangular die shapes in specific locations while maintaining rectangular shapes in other areas, providing shape flexibility without complicating the overall manufacturing process.
3Volume of moving object
If semiconductor package size is decreased, then economic and technological benefits are achieved, but risk of damage to semiconductor die and package increases
Solution Approach 1:
The patent applies protective coatings and encapsulation materials to the semiconductor die and package structures before final assembly and handling. These protective layers act as a cushion against mechanical damage that could occur during subsequent manufacturing steps or application. The prior protection is especially important for miniaturized packages that are more vulnerable to damage.
Data Source
AI summary
Implementations of a semiconductor package may include a semiconductor die including a first side and a second side, the first side of the semiconductor die including one or more electrical contacts; and an organic material covering at least the first side of the semiconductor die. Implementations may include where the one or more electrical contacts extend through one or more openings in the organic material; a metal-containing layer coupled to the one or more electrical contacts; and one or more slugs coupled to one of a first side of the semiconductor die, a second side of the semiconductor die, or both the first side of the semiconductor die and the second side of the semiconductor die.