Semiconductor Die Cooling Interface for Thin Direct Fluid Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor die packages face challenges in efficiently dissipating heat, leading to potential damage from high temperatures, and require additional components like thermal interface materials, heat spreaders, and lids that increase thickness and manufacturing complexity.
Innovation Solution
Incorporating a cooling interface region with channel regions and pillar structures directly exposed to fluids, promoting turbulent flow and enhancing convective heat transfer without the need for additional thermal components, thereby reducing package thickness and manufacturing resources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thermal management components (thermal interface materials, heat spreaders, lids) are used, then heat dissipation is achieved, but package thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the need for separate thermal interface materials, heat spreaders, and lid components by integrating their thermal management functions directly into the substrate and interposer structures. The substrate itself is configured with thermal pathways and the interposer provides thermal conduction, removing the requirement for additional thermal management layers and reducing overall package thickness.
Solution Approach 2:
The patent merges thermal management functions with the structural components of the semiconductor package. The substrate combines mechanical support with thermal conduction pathways, and the interposer integrates both electrical interconnection and thermal management functions. This consolidation of multiple functions into single components eliminates the need for separate thermal management layers, thereby reducing package thickness.
2Temperature
If traditional thermal management components are used, then heat dissipation is achieved, but manufacturing complexity and resource consumption increase
Solution Approach 1:
The patent removes the need for separate thermal interface materials, heat spreaders, and lid components from the manufacturing process. By integrating thermal management functions into the substrate and interposer, the number of discrete components requiring procurement, handling, and assembly is reduced, thereby simplifying the manufacturing process and reducing resource consumption.
Solution Approach 2:
The patent combines thermal management functions with the fabrication of existing structural components (substrate and interposer). This merging allows thermal pathways and conduction features to be created during the same manufacturing processes used to create the structural elements, eliminating the need for separate assembly steps and reducing manufacturing complexity.
3Productivity
If cooling interface region with turbulent flow structures is implemented, then convective heat transfer rate increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by creating pillar structures with varying heights at different locations within the cooling interface region. The first pillar structure has a first height and the second pillar structure has a second height, creating localized variations in the flow path. This local variation in structure height promotes turbulent flow and enhances convective heat transfer while the precision requirements are managed through the overall design rather than requiring ultra-precise uniformity across all structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases heat transfer rates, reduces package thickness for more compact designs, and enhances manufacturing efficiency by eliminating the need for thermal interface materials and heat spreaders.
Implementation Method 1
The array is configured to transfer heat from the integrated circuit die to a fluid using thermal convection
Implementation Method 2
the one or more connection structures are configured to conduct heat from the integrated circuit die to a substrate below integrated circuit die using thermal conduction
Data Source
AI summary
Some implementations described herein include systems and techniques for fabricating a semiconductor die package that includes a cooling interface region formed in surface of an integrated circuit die. The cooling interface region, which includes a combination of channel regions and pillar structures, may be directly exposed to a fluid above and/or around the semiconductor die package.