Die-Cut UHF Antenna Manufacturing with Releasable Adhesive

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Solution Overview

Problem

Current methods for producing UHF antennas for EAS and RFID tags are not cost-effective, especially for very thin antennas with simpler geometry, as they require complex manufacturing processes that are not efficient for thin, simple geometries.

Innovation Solution

A method involving a conductor sheet with a liner sheet and adhesive, where the conductor sheet is die-cut into desired shapes without penetrating the liner, allowing for the removal of scrap material and leaving the antennas releasably secured to the carrier web, which can be reused, utilizing standard equipment from the label converting industry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional methods using patterned adhesive and die cutting are used to produce UHF antennas, then antenna functionality is achieved, but manufacturing cost increases and manufacturing simplicity deteriorates

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidprocess complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts the adhesive layer from the antenna structure itself and places it on the carrier web instead. This allows the antenna to be die-cut without the adhesive interfering with the cutting process or requiring complex patterned adhesive application, simplifying the manufacturing process while maintaining antenna functionality

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of applying adhesive in the shape of the antenna onto a substrate and then die-cutting, the patent inverts the approach by applying adhesive onto the carrier web first, then forming the antenna shape in the conductive material layer and die-cutting through it. This reversal eliminates the need for complex patterned adhesive application

Inventive Principle:
Principle #13The other way round (Inversion)

2Ease of manufacture

If conventional die cutting through the entire substrate is used, then antenna shapes are created, but material waste increases

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidmaterial waste
Core Design Contradiction:
Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent segments the substrate into multiple functional layers (conductive material layer and carrier web layer) that can be differentially processed. The die cutting operation is segmented to cut only the conductive material layer while leaving the carrier web intact, enabling scrap removal without wasting the reusable carrier web

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies discarding and recovering by removing only the scrap conductive material while preserving the carrier web for reuse. The carrier web is recovered and can be used again to support new antenna formations, significantly reducing material waste compared to conventional methods that discard the entire substrate

Inventive Principle:
Principle #34Discarding and recovering

3Length of moving object

If thin conductor sheets are used for UHF antennas, then antenna thickness is reduced, but handling and manufacturing difficulty increases

Engineering Contradiction:
Improveantenna thicknessVSAvoidmanufacturing ease
Core Design Contradiction:
Length of moving objectVSEase of manufacture

Solution Approach 1:

The patent uses the carrier web as an intermediary that supports the thin conductive material layer throughout the manufacturing process. The carrier web provides mechanical strength and handling capability to the otherwise fragile thin antenna material, enabling easy die-cutting and manipulation without increasing antenna thickness

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a flexible carrier web that can accommodate and support thin conductive film structures. The carrier web's flexibility allows it to conform to the thin antenna material while providing the necessary structural integrity for manufacturing operations, enabling production of very thin UHF antennas

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of very thin, flexible UHF antennas at a low cost by simplifying the manufacturing process and reducing waste, while using standard equipment to achieve high-speed production.

Implementation Method 1

an adhesive substantially coextensive with the conductor sheet

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS7497004B2Process for making UHF antennas for EAS and RFID tags and antennas made thereby
Publication Date: 2009.03.03 CHECKPOINT SYSTEMS INC
  • US7497004B2 patent drawing
  • US7497004B2 patent drawing
  • US7497004B2 patent drawing

AI summary

A method of making UHF antennas for security tag and antennas thereby. A web of electrically conductive material having a thickness in the range of approximately 5 to approximately 50 microns is releasably secured to a carrier web using a releasably securable adhesive substantially coextensive with the conductive web. A series of antennas of a desired shape are die-cut into the conductive web, but not into the carrier web. The portion of the conductive web not making up the antennas is in the form of scrap and is removed, thereby leaving the series of antennas releasably secured to the carrier sheet. The antennas are arranged to be removed from the carrier sheet, whereupon the releasably securable adhesive is transferred to them, so that they may be subsequently secured to other components to form a security tag.