Semiconductor Package Molding Powder Patterning for Flat Encapsulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The compression molding process for semiconductor packages faces challenges in achieving uniform distribution of molding powder, which can lead to uneven encapsulation and potential damage to semiconductor dies due to non-uniform fluid or gel molding compound formation.
Innovation Solution
A system and method involving a measurement unit and dispensing unit to accurately measure and control the amount of molding powder, ensuring uniform dispensing onto a carrier with semiconductor devices, using a delivery apparatus and dispensing unit to form a specific pattern that compensates for varying semiconductor device densities, resulting in a flat top surface of the molding compound during compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If molding powder is dispensed without measurement and control, then the process is simple and fast, but the distribution of molding powder is non-uniform
Solution Approach 1:
The system measures the amount of molding powder before dispensing and calculates the required amount in advance based on the area to be covered and target thickness. This preliminary measurement and calculation ensures uniform distribution without requiring complex real-time control during dispensing.
Solution Approach 2:
The measurement unit provides feedback on the actual amount of molding powder dispensed, which is compared with the target amount. The system adjusts subsequent dispensing operations based on this feedback to maintain uniform distribution across the semiconductor device.
2Manufacturing precision
If varying amounts of molding powder are used to compensate for device density, then uniform encapsulation is achieved, but the process becomes more complex
Solution Approach 1:
The system applies different amounts of molding powder to different regions based on the local density of semiconductor devices. Areas with higher device density receive less powder, while areas with lower density receive more powder, achieving uniform encapsulation thickness across the entire substrate.
Solution Approach 2:
The dispensing amount parameter is dynamically adjusted based on the calculated requirements for each region. The system changes the dispensing parameters (amount, speed, pattern) to compensate for variations in semiconductor device density and achieve uniform encapsulation.
3Manufacturing precision
If molding powder amount is not controlled, then the process is simple, but height differences occur in the molding compound
Solution Approach 1:
The system calculates and determines the exact amount of molding powder needed before dispensing, based on the target thickness and area to be covered. This preliminary determination ensures that the correct amount is dispensed, resulting in a flat surface without height differences.
Solution Approach 2:
The system replaces manual or mechanical estimation of powder amounts with automated measurement and calculation. The measurement unit and control system automatically determine and adjust powder amounts, eliminating the need for manual intervention and ensuring consistent surface flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures even distribution of molding powder, minimizing height differences in the molding compound, preventing semiconductor device displacement during compression and ensuring a uniform encapsulant coverage, thus enhancing the reliability and integrity of semiconductor packages.
Implementation Method 1
measuring an amount of a molding powder
Implementation Method 2
the plastic molding powder is melted by heating to become a fluid molding compound or a gel molding compound
Implementation Method 3
a mold chase is used to compress the fluid molding compound or the gel molding compound
Implementation Method 4
the molding compound is cured or solidified to form an encapsulant to cover the semiconductor die
Data Source
AI summary
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.