Die Edge Adhesion Test Structure for Mold Compound Qualification

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Solution Overview

Problem

Current methods for testing interfacial adhesion strength between a semiconductor die's vertical edges and the epoxy mold compound are inadequate, leading to premature qualification and increased field failures and returns due to insufficient characterization of this critical parameter.

Innovation Solution

A structure and method for testing interfacial adhesion strength between the epoxy mold compound and vertical edges of a semiconductor die, using a test vehicle with an interfacial adhesion testing structure that extends laterally beyond the die edges, allowing for comprehensive characterization of adhesion properties through mechanical loading tests.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If current testing methods are used for interfacial adhesion strength, then the testing process is simple, but the measurement precision and reliability are insufficient leading to premature qualification

Engineering Contradiction:

Improveinterfacial adhesion strength measurementVSAvoidtesting structure

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The testing structure extends laterally beyond the die edges into a third dimensional space, creating an L-shaped configuration that allows force application at the vertical edges rather than only at the top surface. This dimensional extension enables direct measurement of interfacial adhesion at the critical die-mold compound interface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The testing structure acts as an intermediary element that transfers applied force from the top surface down to the vertical edge interface between the die and mold compound. This mediator structure enables indirect measurement of interfacial adhesion strength through a controlled force transmission path.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If comprehensive adhesion characterization is performed, then reliability improves and field failures reduce, but resource consumption increases

Engineering Contradiction:

Improvesemiconductor die package reliabilityVSAvoidtesting efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The testing structure is formed as an integral part of the mold compound during the molding process itself, before the adhesion testing occurs. This preliminary formation eliminates the need for separate, complex test structure fabrication steps and enables efficient subsequent testing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The testing structure serves multiple functions: it acts as both the mold compound encapsulation material and the force transmission element for adhesion testing. This multi-functionality reduces the need for separate testing components and streamlines the overall testing process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250096046A1Structure for testing interfacial adhesion between mold compound and vertical edges of a semiconductor die

Publication Date: 2025.03.20 MICRON TECHNOLOGY INC

AI summary

Implementations described herein relate to techniques and apparatuses related to a structure that may be used for characterizing properties related to an interfacial adhesion strength between an epoxy mold compound and a vertical edge of a semiconductor die included in a semiconductor die package. The techniques and apparatuses may be used to provide a more comprehensive understanding of interfacial adhesion strengths within the semiconductor die package relative to techniques available in semiconductor industry standards.