Die Edge Interconnect Packaging for Direct Chip-to-Chip Routing
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Solution Overview
Problem
As integration density increases in semiconductor packages, connecting integrated circuit dies through interposers alone becomes challenging, requiring innovative edge interconnect features to facilitate direct communication and packaging without the need for interposers.
Innovation Solution
The implementation of edge interconnect features, which are conductive lines extending through sealing rings and exposed on the edge surfaces of integrated circuit dies, allowing direct connection between dies without interposers, achieved through a selective metal bumping process during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interposers are used to connect integrated circuit dies, then communication between dies is enabled, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the interposer component from the traditional die-connection system. By forming conductive lines directly through the sealing rings on the die edges, the invention removes the intermediate interposer substrate, thereby reducing manufacturing complexity while maintaining die-to-die communication capability
Solution Approach 2:
The patent merges the sealing ring structure with the interconnect function. The conductive lines are formed directly through the sealing rings, combining the previously separate functions of sealing and electrical interconnection into a single integrated structure, eliminating the need for separate interposers
2Reliability
If interposers are used to connect integrated circuit dies, then routing is provided, but routing density is limited
Solution Approach 1:
The patent transitions from planar routing through interposer substrates to three-dimensional routing through the vertical depth of sealing rings. Conductive lines can be formed at different depths and angles within the sealing rings, enabling higher routing density by utilizing the third dimension rather than being constrained to two-dimensional interposer surfaces
3Ease of manufacture
If direct connection between dies is implemented, then manufacturing cost is reduced, but connection reliability may be compromised
Solution Approach 1:
The sealing rings serve multiple functions simultaneously: providing environmental sealing for the die and serving as the interconnect medium for electrical connections. This multi-functionality eliminates the need for separate interposer components, reducing manufacturing cost while maintaining connection reliability through the robust sealing ring structure
Data Source
AI summary
Embodiments of the present disclosure provide an integrated circuit die having edge interconnect features. The edge interconnect features may be conductive lines extending through sealing rings and exposed on edge surfaces of the integrated circuit die. The edge interconnect features are configured to connect with other integrated circuit dies without going through an interposer. The semiconductor device may include two or more integrated circuit dies with edge interconnect features and connected through one or more inter-chip connectors formed between the two or more integrated circuit dies. In some embodiments, the inter-chip connectors may be formed by a selective bumping process during packaging.