Integrated Die-Edge Sensors for Precise Crack Localization
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Solution Overview
Problem
Existing sensors in electronic devices cannot accurately locate cracks in dies and require extensive inspection to determine their presence and location, leading to inefficiencies in crack detection.
Innovation Solution
The implementation of multiple sensors adjacent to the peripheral edges of a die, each with access transistors and an edge guard ring, allows for rapid and precise crack detection by comparing electrical parameters between sensors, using both comparison and reference parameter techniques to identify and locate cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single sensor is used to detect cracks in a die, then crack detection capability is provided, but the ability to locate the crack within the die is insufficient
Solution Approach 1:
The patent divides the die into multiple regions by placing multiple sensors at different locations (e.g., corners and edges). Each sensor monitors a specific region, and by comparing the responses of multiple sensors, the system can precisely locate the crack within the die. This segmentation approach transforms a single undifferentiated detection zone into multiple localized monitoring areas.
2Measurement precision
If extensive inspection analysis is performed to locate cracks, then accurate crack location is achieved, but the inspection time and complexity increase significantly
Solution Approach 1:
The patent incorporates sensors into the die structure during the manufacturing process itself, rather than adding them later during inspection. These pre-installed sensors continuously monitor the die for cracks, so that when a crack occurs, its location is immediately identified by which sensor detects it, eliminating the need for time-consuming post-manufacturing inspection analysis.
Solution Approach 2:
The die structure itself provides the sensing capability through integrated sensors that automatically detect and locate cracks. The system uses the die's own structural elements (edges, corners) as sensor placement locations, allowing the die to self-monitor its integrity without requiring external inspection equipment or procedures.
3Measurement precision
If sensors are placed at multiple locations around the die, then crack location precision is improved, but the device structure becomes more complex
Solution Approach 1:
The patent combines multiple sensor functions into a unified monitoring system where sensors at different locations (corners and edges) work together as an integrated network. The sensors share common readout circuits and processing logic, allowing multiple detection points to be managed through a single coordinated system rather than separate independent monitoring channels.
Solution Approach 2:
The sensor system is designed to perform multiple functions: detecting cracks, locating their position, and potentially monitoring stress distribution throughout the die. The same sensor infrastructure serves both quality control during manufacturing and ongoing reliability monitoring, providing universal utility across different operational phases.
Data Source
AI summary
In an aspect, an electronic device can include a first sensor adjacent to a first portion of a peripheral edge of a die, a first access transistor electrically coupled to the first sensor, a second sensor adjacent to a second portion of the peripheral edge, and a second access transistor electrically coupled to the second sensor. In another aspect, an electronic device can include an edge guard ring and a sensor electrically insulated from the edge guard ring. The edge guard ring can include a interconnect. At least a portion of the first sensor overlaps or underlaps a portion of the first interconnect. Testing can be performed by comparing the electrical parameters of two or more sensors or by comparing the electrical parameters of one sensor versus a reference value. Testing can be performed at nearly any time, including after the electronic device is installed in a system.