Die Eject Poker Pin Self-Aligning Tapered Interface
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Solution Overview
Problem
Existing die eject assemblies in semiconductor bonding machines are prone to errors in poker pin height adjustment, leading to potential damage to semiconductor dies due to improper pin positioning and over-travel issues, which can result in inconsistent and potentially damaging ejection processes.
Innovation Solution
A die eject assembly featuring a poker pin with a distinct base and shaft configuration, where the base portion has a larger diameter than the shaft, and a lock member that ensures precise positioning and limits the pin's travel to prevent over-travel, utilizing a reciprocating member and an annular stopper within a vacuum dome to maintain accurate die ejection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment of poker pin height is used, then flexibility in positioning is achieved, but adjustment precision deteriorates leading to potential die damage
Solution Approach 1:
The poker pin assembly is designed to be self-aligning through the interaction between the tapered portion of the poker pin and the corresponding tapered bore in the holder. As the poker pin is inserted, the tapered surfaces guide it into the correct angular and positional orientation automatically, eliminating the need for manual alignment adjustments while ensuring precise positioning.
Solution Approach 2:
The invention changes the geometric parameters of the poker pin and holder interface by introducing specific tapered surfaces with defined angles. This geometric parameter change transforms the adjustment mechanism from manual positioning to automatic self-alignment, ensuring consistent precise positioning without requiring operator skill or manual adjustment.
2Ease of operation
If increased travel range of poker pin is allowed, then ease of die ejection is improved, but risk of over-travel and die damage increases
Solution Approach 1:
The stop member is positioned in advance within the vacuum dome to prevent excessive upward travel of the poker pin. This preliminary protective measure counteracts the potential harmful effect of over-travel before it can occur, allowing the poker pin to have sufficient travel range for effective die ejection while ensuring it cannot exceed the safe limit that would cause die damage.
Solution Approach 2:
The stop member acts as an intermediary element between the poker pin and the vacuum dome structure. It mediates the motion of the poker pin by providing a physical barrier that limits travel range, thus protecting the die from over-travel damage while allowing adequate motion for proper die ejection function.
3Manufacturing precision
If fixed relationship between poker pin and holder is used, then positioning consistency is improved, but adjustment flexibility is reduced
Solution Approach 1:
The correct positioning relationship between the poker pin and holder is established in advance through the tapered self-aligning design. During assembly, the tapered surfaces automatically guide the poker pin into the precise correct position, performing the positioning action preliminarily before operation begins. This eliminates the need for subsequent adjustments while maintaining consistent positioning.
Solution Approach 2:
The poker pin assembly performs its own positioning function through the self-aligning tapered interface between the pin and holder. The geometry of the tapered surfaces causes the poker pin to automatically assume the correct position and orientation during insertion, making the system self-positioning and eliminating the need for external adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures consistent and accurate die ejection by maintaining precise pin height and preventing over-travel, thereby reducing the risk of die damage and ensuring reliable operation across varying conditions such as temperature changes.
Implementation Method 1
a vacuum environment within a vacuum dome
Data Source
AI summary
Disclosed herein is a die eject assembly for a die bonder that may include a poker pin having an elongate shaft portion with a first end and a second end. The poker pin further includes a base portion having a first end and a second end. The base portion has a maximum diameter that is larger than the maximum diameter of the elongate shaft portion. The elongate shaft portion first end is fixedly attached to the base portion second end.


