Die Ejector Vacuum Chamber Plate Mechanism
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Solution Overview
Problem
Existing die ejector technologies are inadequate for reliably and efficiently detaching thin semiconductor chips from foils without causing damage, due to increased adhesive strength and reduced chip thickness.
Innovation Solution
A die ejector with a vacuum chamber and displaceable plates driven by a motor and pin mechanism, allowing for precise and rapid detachment by adjusting the position of plates relative to the chip, enabling efficient and damage-free removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If needle-supported methods are used for detachment, then the detachment process can be performed, but the method is slow and causes damage to thin semiconductor chips
Solution Approach 1:
The patent applies vacuum (pneumatic principle) by creating a vacuum chamber that sucks the foil together with the semiconductor chip. This pneumatic approach replaces the slow and damaging needle-supported mechanical detachment method, enabling rapid and damage-free removal of thin semiconductor chips from the foil.
Solution Approach 2:
The patent segments the detachment process into two distinct phases: first, the vacuum chamber sucks the foil together with the chip for initial attachment; second, the support structures are lowered sequentially or simultaneously to detach the chip from the foil while maintaining vacuum hold. This segmentation enables both speed and reliability in the detachment process.
2Reliability
If conventional detachment methods are used, then the process can be completed, but the methods are not reliable enough for thin chips with adhesive layers
Solution Approach 1:
The patent employs nested structures where support structures are disposed between the foil and the semiconductor chip, and these support structures are themselves disposed between the foil and the rods with flat ends. This nested arrangement provides multiple levels of support and control, enhancing detachment reliability for thin chips with adhesive layers while maintaining a compact ejector structure.
Solution Approach 2:
The support structures are designed to be displaceable in a controlled manner, allowing dynamic adjustment during the detachment process. They can be lowered sequentially or simultaneously based on process requirements, providing flexibility and reliability in handling thin semiconductor chips with varying adhesive properties.
3Productivity
If the foil is drawn over the edge of the die ejector for removal, then detachment can be achieved, but the method is slow and may damage thin chips
Solution Approach 1:
The patent applies preliminary action by first creating vacuum to attach the foil together with the semiconductor chip to the chamber floor before any detachment movements occur. This preliminary vacuum attachment ensures the chip is securely held and properly positioned, enabling subsequent rapid and safe detachment without chip damage.
Solution Approach 2:
The vacuum chamber acts as an intermediary that simultaneously holds both the foil and the semiconductor chip during the detachment process. This intermediary vacuum field enables coordinated movement and controlled separation, achieving rapid detachment while eliminating the harmful effects of direct mechanical contact that could damage thin chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid, reliable, and damage-free detachment of thin semiconductor chips by optimizing the sequence and speed of plate movement, improving throughput and reducing chip damage during the detachment process.
Implementation Method 1
the foil beneath the semiconductor chip is subjected to a vacuum at many individual locations in order to remove the foil at these places from the semiconductor chip
Data Source
AI summary
A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path.