Die Extractor Base Vacuum Channels Peel Adhesive Tape
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Solution Overview
Problem
Existing methods for separating semiconductor dies from adhesive tape, such as using ejector pins, often result in die cracks, particularly for thinner and more brittle dies, leading to lower yield and reliability in packaged devices.
Innovation Solution
A die extractor base with non-parallel channels coupled to a vacuum source is used to progressively peel the adhesive tape away from the die, reducing strain and the likelihood of cracks, by narrowing the spacing between channels as the die moves across the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If ejector pins are used to separate dies from adhesive tape, then separation effectiveness is improved for thick dies, but die cracks occur on thin dies leading to lower yield and reliability
Solution Approach 1:
The patent replaces the mechanical ejector pin system with a thermal field-based solution. A heating element applies controlled heat to the adhesive tape interface, thermally softening the adhesive to enable die separation without mechanical contact. This substitution eliminates the mechanical stress that causes die cracks while maintaining separation effectiveness.
Solution Approach 2:
The patent changes the physical state of the adhesive tape by applying thermal energy. The heating element raises the temperature of the adhesive interface, transitioning it from a rigid adhesive state to a softened, more compliant state that allows die separation without cracking. This parameter change (temperature) resolves the contradiction between separation effectiveness and die integrity.
2Ease of operation
If ejector pins are projected to push dies through an anvil, then die separation is achieved, but mechanical stress causes cracks on thin and brittle dies
Solution Approach 1:
The patent replaces the mechanical push-action of ejector pins with a thermal field approach. Instead of mechanically pushing dies through an anvil, the system uses a heating element to thermally soften the adhesive, allowing dies to be separated without mechanical contact or stress. This eliminates the harmful mechanical stress that causes cracks on thin and brittle dies.
Solution Approach 2:
The patent introduces thermal energy as an intermediary between the die separation objective and the adhesive interface. The heating element applies heat as a mediating field that softens the adhesive, creating a compliant interface that allows separation without direct mechanical contact. This intermediary thermal field resolves the contradiction by enabling separation while avoiding harmful mechanical stress.
3Productivity
If conventional separation techniques are used, then processing speed is maintained, but yield and long term reliability decrease due to die cracks
Solution Approach 1:
The patent replaces mechanical separation methods with a thermal field-based separation system. A heating element applies controlled heat to the adhesive interface, thermally softening it to enable die separation without mechanical contact. This maintains processing speed while eliminating die cracks, thereby improving long term reliability without sacrificing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively separates dies from adhesive tape without causing cracks, improving yield and reliability, especially for thin and brittle dies, by using applied vacuum to progressively peel the tape, reducing mechanical stress.
Implementation Method 1
A die extractor base with non-parallel channels coupled to a vacuum source is used to progressively peel the adhesive tape away from the die
Implementation Method 2
by using applied vacuum to progressively peel the tape, reducing mechanical stress
Data Source
AI summary
The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies.