Semiconductor Die Flip Sorting on the Same Carrier

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Solution Overview

Problem

Current die sorter tools are inefficient as they require operators to prepare and load large quantities of empty carriers, limiting continuous operation and causing inefficiencies due to their single 'in and out' design, which prevents flipping dies on the same carrier and leads to potential damage from human handling.

Innovation Solution

A multi-flip semiconductor die sorter tool with multiple lanes and die flip modules that can manipulate dies on the same carrier, flipping and repositioning them without changing their position within the carrier, and includes an optical system for die identification and handling, allowing continuous operation and reducing human handling-induced damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If current die sorter tools use a single 'in and out' design with separate carriers, then operators can load and remove dies, but the tool cannot operate continuously and requires large quantities of empty carriers

Engineering Contradiction:

Improvecontinuous operation capabilityVSAvoidcarrier management complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent combines the functions of receiving and returning carriers into a single lane. The same lane that receives carriers with dies also returns the same carriers after processing, eliminating the need for separate receiving and returning lanes. This merging allows the tool to continuously process dies on the same carrier without requiring operators to manage multiple empty carriers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The single lane serves multiple functions: it receives carriers with dies, transports them to the processing position, and returns the same carriers after die manipulation. This multi-functional lane design eliminates the need for separate carrier management systems and enables continuous operation by repeatedly using the same carrier.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of operation

If current die sorter tools flip dies from one carrier to another, then dies can be manipulated, but operators must prepare and load large quantities of empty carriers

Engineering Contradiction:

Improvedie manipulation capabilityVSAvoidcarrier preparation and loading time

Core Design Contradiction:

Ease of operationVSLoss of time

Solution Approach 1:

The system performs die manipulation on the same carrier without transferring to another carrier. The carrier is prepared in advance to receive manipulated dies, and the same carrier is reused after processing. This eliminates the preliminary action of preparing empty carriers and the subsequent time-consuming process of loading them into the tool.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The carrier serves itself by being returned to the same lane after processing. The system automatically manages the carrier lifecycle within the single lane, eliminating the need for external operator intervention to prepare and load empty carriers. The carrier is reused in a self-sustaining cycle within the same lane.

Inventive Principle:

Principle #25Self-service

3Ease of operation

If current die sorter tools use human handling for die manipulation, then dies can be transferred between carriers, but human handling causes potential damage to dies

Engineering Contradiction:

Improvedie transfer capabilityVSAvoiddie integrity

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent replaces human mechanical handling with an automated die manipulation system. The system uses mechanical arms or robotic mechanisms to pick up, flip, and place dies on the same carrier without human contact. This substitution eliminates the risk of human handling damage while maintaining die transfer capability through automated precision manipulation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS11915954B2Multi-flip semiconductor die sorter tool

Publication Date: 2024.02.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.