Semiconductor Die Grooving for Delamination Containment
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Solution Overview
Problem
Semiconductor device packages experience delamination failures due to stress caused by swelling and expansion of the molding compound during reliability testing, which reduces yield.
Innovation Solution
Incorporating a second groove between the first groove and the seal ring of the semiconductor die to contain potential delamination, formed through laser grooving before attachment to the substrate, which prevents delamination from propagating into the active region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a first groove is formed in the scribe line region for blade sawing separation, then the semiconductor die packages can be separated into individual pieces, but stress from molding compound swelling can cause delamination to propagate from the scribe line region into the active region
Solution Approach 1:
The patent divides the scribe line region into multiple grooves (first groove for separation, second groove for stress containment) to segment the stress propagation path. The second groove acts as a barrier that segments the potential delamination path, preventing stress from the molding compound from reaching the active region while maintaining the separation function of the first groove.
Solution Approach 2:
The second groove serves as an intermediary structure between the first groove (separation feature) and the seal ring (protection feature). It mediates the stress by providing an additional containment barrier that intercepts delamination before it can propagate into the active region, thus protecting the semiconductor die packages without interfering with the separation process.
2Reliability
If the molding compound is deposited around the semiconductor die packages, then the die packages are encapsulated and protected, but the molding compound swells during reliability testing causing stress and delamination failures
Solution Approach 1:
The patent extracts the harmful swelling stress from the active region by providing the second groove as a dedicated containment structure in the scribe line region. This groove captures and isolates the stress generated by molding compound swelling, preventing it from affecting the active region where the semiconductor devices are located.
Solution Approach 2:
The patent converts the harmful swelling stress into a contained phenomenon by designing the second groove to specifically capture and contain the delamination caused by molding compound expansion. The stress that would otherwise be destructive is redirected and contained within the groove structure, transforming a harmful effect into a controlled and localized phenomenon.
3Reliability
If laser grooving is performed to form grooves in the scribe line region, then grooves are created for separation and stress containment, but additional process steps are required
Solution Approach 1:
The patent merges the separation function (first groove) and the stress containment function (second groove) into a single integrated structure in the scribe line region. Both grooves are formed in the same region using the same laser grooving process, combining multiple functions into one structural feature set, thus reducing overall device complexity while achieving both separation and delamination containment.
Solution Approach 2:
The patent performs preliminary laser grooving to form both the first and second grooves in the scribe line region before the molding compound is deposited. This preliminary action creates the stress containment structure in advance, ensuring that when the molding compound swells during reliability testing, the delamination is already contained within the pre-formed grooves, preventing propagation into the active region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the likelihood of delamination and increases the yield of semiconductor device packages by mitigating stress transfer from the molding compound.
Implementation Method 1
Laser grooving can be performed to form grooves in the semiconductor die prior to blade sawing
Data Source
AI summary
A laser grooving operation is performed to form a plurality of grooves in a semiconductor die prior to attaching the semiconductor die to a semiconductor device package substrate. In addition to forming a first groove through which blade sawing is to be performed to separate the semiconductor die from other semiconductor dies, a second groove may be formed between the first groove and a seal ring of the semiconductor die. The second groove is configured to contain any potential delamination that might otherwise propagate to an active region of the semiconductor die. Accordingly, the second groove and the associated laser grooving operation described herein may reduce the likelihood of delamination that might otherwise be caused by swelling and/or expansion in a molding compound formed around the semiconductor die after the semiconductor die is attached to the semiconductor device package substrate.