Die Heat Dissipation Cover Structure to Prevent Debris and Separation

Solution Overview

Problem

Conventional chip designs face challenges in heat dissipation efficiency, generation of metal debris during dicing, and separation of the heat dissipation cover from the die.

Innovation Solution

A chip structure and manufacturing method where a heat dissipation cover is formed on the back and lateral surfaces of each die after dicing, using a design with a first portion on the back surface, a second portion on the lateral surface, and a connection portion at the outer corner, preventing metal debris generation and enhancing mechanical strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat dissipation layer is formed on the backside of the wafer before the dicing process, then the heat dissipation performance is improved, but metal debris is generated during dicing and may adhere on the carrier and exposed surfaces of the dies

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidmetal debris generation

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The heat dissipation cover is formed on the back surface and lateral surface of the die before the dicing process. This preliminary formation allows the heat dissipation structure to be in place before cutting, but the cover's geometry (with recessed regions) prevents it from interfering with the dicing blade, thereby avoiding metal debris generation while maintaining heat dissipation performance

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The heat dissipation cover is divided into multiple portions (first portion on back surface, second portion on lateral surface, and connection portion) that are separated by recessed regions. This segmentation allows different parts of the cover to serve different functions: the first portion provides heat dissipation on the back surface, the second portion provides heat dissipation on the lateral surface, and the connection portion connects them while the recessed regions prevent interference with dicing

Inventive Principle:

Principle #1Segmentation

2Temperature

If the heat dissipation layer is formed on the backside of the wafer before the dicing process, then the heat dissipation performance is improved, but the heat dissipation sheets may separate from the dies due to stress generated during dicing

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidseparation of heat dissipation cover from die

Core Design Contradiction:

TemperatureVSStability of the object's composition

Solution Approach 1:

The heat dissipation cover is formed on the back surface and lateral surface of the die before the dicing process. This preliminary formation allows the heat dissipation structure to be in place before cutting, but the cover's geometry (with recessed regions) prevents it from interfering with the dicing blade, thereby avoiding metal debris generation while maintaining heat dissipation performance

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The heat dissipation cover is divided into multiple portions (first portion on back surface, second portion on lateral surface, and connection portion) that are separated by recessed regions. This segmentation allows different parts of the cover to serve different functions: the first portion provides heat dissipation on the back surface, the second portion provides heat dissipation on the lateral surface, and the connection portion connects them while the recessed regions prevent interference with dicing

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If the heat dissipation cover is formed to cover only the back surface of the die, then the manufacturing process is simple, but the heat dissipation area is limited and heat dissipation efficiency is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The heat dissipation cover extends from the back surface onto the lateral surface of the die, adding a vertical/dimensional extension. The first portion covers the back surface while the second portion extends onto the lateral surface, thereby increasing the total heat dissipation area without significantly complicating the manufacturing process

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The heat dissipation cover is divided into multiple portions (first portion on back surface, second portion on lateral surface, and connection portion) that are separated by recessed regions. This segmentation allows different parts of the cover to serve different functions: the first portion provides heat dissipation on the back surface, the second portion provides heat dissipation on the lateral surface, and the connection portion connects them while the recessed regions prevent interference with dicing

Inventive Principle:

Principle #1Segmentation

Data Source

PatentEP4498417A1Chip structure and method of manufacturing the same

Publication Date: 2025.01.29 CHIPBOND TECH

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AI summary

In a method of manufacturing a chip structure, a first carrier is attached on a back surface of a wafer, the wafer is diced into individual dies and there is a groove formed between the adjacent dies, then a second carrier is attached on an active surface of the wafer and the first carrier is removed to expose the groove, a back surface and a lateral surface of each of the dies, a heat dissipation cover is formed on the back surface and the lateral surface of each of the dies to obtain chip structures. The heat dissipation cover is provided to increase heat dissipation efficiency of the dies and prevent formation of metal debris which may contaminate the dies. Furthermore, the heat dissipation cover is prevented from being separated from the die. The application also discloses chip structure.