Die Identification via Dummy Pad Circuit Measurement
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Solution Overview
Problem
Conventional flip-chip package technologies lack a method to automatically generate die identification (ID) for each die, leading to delayed cycle times and frequent errors during yield improvement analysis, as manual identification is time-consuming and prone to errors.
Innovation Solution
A package structure and method that includes a die mounted on a substrate with solder balls and dummy pads, where the presence or absence of dummy bumps between the die pads and substrate pads determines a binary die ID, allowing for automated identification by measuring circuit establishment through solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual die ID writing is used by packaging facilities, then die identification can be provided, but cycle time is delayed and error rates increase
Solution Approach 1:
The package structure itself generates the die ID through its inherent physical characteristics (presence or absence of dummy bumps, circuit establishment patterns) rather than requiring external manual writing. The structure serves its own identification function, eliminating the need for separate manual ID writing processes and enabling automated detection.
Solution Approach 2:
The manual mechanical process of writing die IDs is replaced with an automated electrical measurement system that detects circuit establishment through solder balls. This substitution enables faster, more accurate identification without human intervention.
2Loss of information
If manual die ID writing is used, then die location information can be recorded, but frequent errors occur
Solution Approach 1:
The package structure inherently encodes die location information through its physical configuration (dummy bump patterns, circuit establishment) rather than relying on manual transcription. This self-encoding mechanism eliminates human error in recording die location data.
Solution Approach 2:
The die ID information is automatically copied from the physical structure's characteristics to the identification system through electrical measurement, ensuring accurate reproduction of die location information without manual intervention.
3Ease of manufacture
If conventional package structures are used, then basic packaging function is achieved, but no automated die ID generation is possible
Solution Approach 1:
The package structure performs multiple functions: it provides basic packaging protection and connection while simultaneously encoding die identification information through its dummy bump and circuit establishment patterns. This multi-functionality enables both packaging and automated ID generation within a single structure.
Solution Approach 2:
The package structure is segmented into functional components (dummy pads, dummy bumps, solder balls) where specific segments serve dual purposes: structural/connection functions and identification encoding functions, enabling automated die ID generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and accurate automated die ID generation, reducing cycle time and error rates by using a binary data system to determine the location of each die relative to the wafer, with the potential for expanding configurations based on product demands.
Implementation Method 1
a solder ball on a second surface of the substrate and electrically connect to the dummy pad
Data Source
AI summary
A package structure is disclosed. The package structure includes a die; a substrate disposed corresponding to the die, wherein the substrate comprises a first dummy pad and a second dummy pad on a first surface of the substrate; and a first solder ball and a second solder ball on a second surface of the substrate and electrically connect the first dummy pad and the second dummy pad respectively.