Die-Integrated Voltage Regulator for Multi-Stack ICs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing voltage regulation architectures for multi-stack integrated circuit packages are physically large and inefficient, limiting the speed and functionality of components due to distance between voltage regulators and dies, and often require additional space for inductors, which is not feasible in constrained areas.
Innovation Solution
A fully integrated voltage regulator is implemented on the die itself, incorporating a through silicon via (TSV) inductor, a digital voltage controller, and a capacitor, with the power stage located within the inductor's interior space, allowing for compact and efficient voltage regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If voltage regulators are placed on a circuit board or into the package itself, then voltage regulation function is provided, but the physical distance between the voltage regulator and die increases, limiting speeds for component function
Solution Approach 1:
The voltage regulator is merged with the die by integrating it directly onto the die surface. The regulator includes an inductor formed from conductive material patterns on the die, a capacitor formed from conductive material patterns on the die, and a switching element, all integrated onto the same die to eliminate physical distance and improve speed.
Solution Approach 2:
The voltage regulator components are nested within the die structure. The inductor is formed using conductive material patterns that are part of the die's metal layers, and the capacitor is formed using conductive material patterns within the die's metal layers, effectively nesting the regulator components within the die's existing structure.
2Reliability
If multiple inductors are placed on package, then voltage regulation for multiple dies is enabled, but area constraints make this not feasible in many cases
Solution Approach 1:
Multiple voltage regulators are merged onto a single die by integrating multiple sets of inductor, capacitor, and switching element components on the same die. This allows one die to provide voltage regulation for multiple other dies, eliminating the need for separate regulators for each die and reducing overall package area.
Solution Approach 2:
A single die with an integrated voltage regulator is designed to serve multiple functions by regulating voltage for multiple other dies in the package. The regulator can be configured to provide voltage to different dies, making the die universal and reducing the total number of regulators needed in the package.
3Area of stationary object
If voltage regulators are integrated onto the die, then area requirements are reduced and speed is improved, but the complexity of integrating multiple components increases
Solution Approach 1:
The inductor, capacitor, and switching element are merged into a single integrated voltage regulator structure on the die. The inductor is formed from conductive material patterns in the die's metal layers, the capacitor is formed from conductive material patterns in the die's metal layers, and the switching element is integrated, combining multiple components into one unified structure.
Solution Approach 2:
The integrated voltage regulator is designed as a universal building block that can be replicated and configured for different voltage regulation needs. Once the integration methodology is established, it can be applied consistently across multiple dies, reducing the overall complexity of the system even though individual die integration is complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables faster and more efficient voltage regulation by physically locating the voltage regulator closer to the load, reducing area requirements and allowing for independent voltage control of each die, thereby enhancing the overall performance and efficiency of multi-stack integrated circuits.
Implementation Method 1
A fully integrated voltage regulator is implemented on the die itself, incorporating a through silicon via (TSV) inductor
Implementation Method 2
A fully integrated voltage regulator is implemented on the die itself, incorporating a through silicon via (TSV) inductor, a digital voltage controller, and a capacitor
Data Source
AI summary
A voltage regulator for one or more dies in a multi-stack integrated circuit includes an inductor located on a die, a voltage controller that is electrically coupled to the inductor and is also located on the die, and a capacitor that is electrically coupled to the inductor and the voltage controller and is also located on the die. The inductor defines an interior space and the voltage controller and the capacitor are located within the interior space of the inductor. The inductor can be a lateral inductor or a through layer via inductor. The multi-stack integrated circuit may have multiple dies. A voltage controller may be electrically coupled to each of the dies, although it may be located on only one of the dies. Alternatively, separate voltage controllers may be electrically coupled to each of the multiple dies and may be located on each of the respective dies.