Semiconductor Die Interface Layout Within Bond Arrays
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Solution Overview
Problem
The challenge in high-integration semiconductor devices is the efficient interlinking of multiple semiconductor dies with flexible interface arrangements that accommodate various pitch designs of bonding components.
Innovation Solution
A semiconductor device design that includes interface circuits with transceivers and receivers arranged within bond array regions, allowing for flexible spacing and compatibility with different bonding component pitches, and utilizing interconnect wiring structures for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If interface circuits are arranged outside the bond array region, then routing is simpler, but substrate space is wasted and integration density decreases
Solution Approach 1:
The interface circuit is merged with the bond array region, allowing the interface circuit to be arranged within the same substrate area as the bonding components. This integration eliminates wasted space and improves substrate utilization without significantly increasing overall device complexity.
Solution Approach 2:
The interface circuit is positioned in a different spatial dimension relative to the bonding components, specifically arranged in an overlapping or adjacent region on the substrate plane. This dimensional arrangement allows both the interface circuit and bonding components to coexist efficiently within the same bond array region.
2Ease of manufacture
If bonding components are arranged with larger pitch, then manufacturing is easier, but interface circuit arrangement flexibility is reduced
Solution Approach 1:
The bond array region serves multiple functions: it accommodates both the bonding components and the interface circuit. This multi-functional design allows the same region to support various pitch configurations of bonding components while maintaining flexibility for interface circuit arrangement, thus achieving both ease of manufacture and design adaptability.
Solution Approach 2:
Different regions within the bond array area are assigned different functions: some areas are optimized for bonding components with appropriate pitch for manufacturing, while other areas within the same region are allocated for interface circuits. This local differentiation allows each component type to have optimal characteristics while maintaining overall flexibility.
3Area of stationary object
If interface circuits are placed inside the bond array region, then substrate space is optimized, but signal transmission reliability may be affected by interference
Solution Approach 1:
The design positions the interface circuit as an intermediary element between the bonding components and the core logic circuits. By arranging the interface circuit within the bond array region with optimized spacing and routing, signal transmission paths are established that minimize interference while maintaining compact layout, thus preserving both space efficiency and signal reliability.
Data Source
AI summary
A semiconductor device including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first substrate, a first interface circuit and first bonding components. The first bonding components are arranged in a first bond array region and the first interface circuit is arranged inside the first bond array region. The second semiconductor die includes a second substrate, a second interface circuit and second bonding components. The first bonding components are connected to the second bonding components, the first interface circuit and the second interface circuit are located between the first substrate and the second substrate, and the first semiconductor die and the second semiconductor die are interlinked by an 10 interface constructed by the first interface circuit, the first bonding components, the second interface circuit and the second bonding components. A method of arranging an interface of a semiconductor device is also provided herein.