Die-to-Die I/O Monitoring With Adjustable Delay-Line Margin Sensing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current die-to-die connectivity monitoring technologies face challenges in accurately measuring interconnect quality parameters, particularly in high-speed applications, due to limited resolution and sensitivity to timing and power changes, which can lead to issues like open-circuit, short-circuit, and micro-bump resistance degradation.

Innovation Solution

An input/output (I/O) sensor system with an adjustable delay-line and comparison circuitry that compares data signals with delayed versions to determine margin measurements, enabling high-resolution monitoring of interconnect quality parameters such as eye pattern and micro-bump resistance, and identifying minimum delay values indicative of fail conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional monitoring technologies are used, then device complexity is reduced, but measurement precision deteriorates due to limited resolution in detecting interconnect quality parameters

Engineering Contradiction:
ImproveresolutionVSAvoidcomplexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The monitoring function is divided into separate I/O sensors embedded at different locations within the multi-IC module, each responsible for monitoring specific interconnect pathways. This segmentation allows for localized high-precision measurements without requiring a complex centralized monitoring system, as each sensor independently monitors its designated interconnects using delay-line and comparison circuitry.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Delay-line circuitry serves as an intermediary mechanism that introduces controlled time delays to data signals before comparison. This intermediary approach enables precise timing measurements by comparing original and delayed signals, achieving high measurement precision for interconnect quality parameters without directly complexifying the core monitoring architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If high-speed data signals are monitored, then productivity is improved, but reliability deteriorates due to sensitivity to timing and power changes causing detection errors

Engineering Contradiction:
Improvedata rateVSAvoiddetection accuracy
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The comparison circuitry provides feedback by continuously comparing original data signals with delayed versions and generating comparison signals that indicate timing margins. This feedback mechanism allows the system to adapt to timing variations in high-speed signals, maintaining reliable detection by identifying when timing margins become insufficient due to interconnect degradation or variations.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The delay-line circuitry pre-establishes time margins by introducing controlled delays before comparison occurs. This beforehand cushioning creates a buffer zone that accounts for expected timing variations in high-speed signals, allowing the system to maintain reliable detection even when timing changes occur during operation, thus preventing detection errors before they happen.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Measurement precision

If margin measurements are performed with high resolution, then measurement precision is improved, but use of energy increases due to timing and power monitoring requirements

Engineering Contradiction:
Improvemargin measurement resolutionVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The monitoring of timing margins and power characteristics is merged into a single integrated comparison operation. The comparison circuitry simultaneously evaluates both timing relationships and signal integrity, allowing high-resolution margin measurements to be obtained without requiring separate power monitoring circuits, thus reducing overall power consumption while maintaining measurement precision.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12072376B2Die-to-die connectivity monitoring
Publication Date: 2024.08.27 PROTEANTECS LTD
  • US12072376B2 patent drawing
  • US12072376B2 patent drawing
  • US12072376B2 patent drawing

AI summary

An input/output (I/O) sensor for a multi-IC module. The I/O sensor includes: delay circuitry, configured to receive a data signal from an interconnected part of an IC of the multi-IC module and to generate a delayed data signal, the delay circuitry including an adjustable delay-line configured to delay an input signal by a set time duration; a comparison circuit, configured to generate a comparison signal by comparing the data signal with the delayed data signal; and processing logic, configured to set the time duration of the adjustable delay-line and, based on the comparison signal, identify a margin measurement of the data signal for determining an interconnect quality parameter.