Semiconductor Die Jig Locking for Automated Chamber Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The complexity of semiconductor fabrication processes requires improved automation and reduced manual intervention in the handling and alignment of semiconductor dies during various processing operations, particularly in the transition between different treatment chambers and tools.
Innovation Solution
A system and process involving automated robots and conveyors to manipulate and align semiconductor dies using adjustable robotic arms and torque-controlled tools to secure dies within jigs, allowing for secure transport and processing without manual intervention, and enabling precise alignment and handling of dies in process chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual handling and alignment of semiconductor dies is used, then flexibility and adaptability are maintained, but human error increases and productivity decreases
Solution Approach 1:
The system enables self-service through automated robots that autonomously perform die handling, alignment, and loading operations without human intervention. The robots navigate the fabrication facility, retrieve dies from storage, and precisely position them in processing chambers, allowing the system to serve itself rather than requiring manual operation.
Solution Approach 2:
Manual mechanical handling is replaced with automated robotic systems equipped with specialized end effectors. These robots use controlled mechanical movements, precision positioning systems, and automated alignment mechanisms to substitute human hands and eyes, eliminating manual intervention while maintaining or improving handling precision.
2Reliability
If automated robots are used for die handling, then productivity increases and human error is reduced, but device complexity increases
Solution Approach 1:
The robotic system is designed with multi-functionality to handle various die types, sizes, and processing requirements using the same basic platform. The robots can perform multiple operations including retrieval, alignment, loading, and navigation, reducing the need for specialized equipment for each task and managing complexity through versatile design.
Solution Approach 2:
The patent introduces intermediary components such as specialized end effectors, alignment fixtures, and communication interfaces that mediate between the robotic system and the semiconductor processing equipment. These intermediaries simplify the interaction between different system components and reduce the overall complexity by providing standardized connection points.
3Manufacturing precision
If precise alignment of dies is required, then manufacturing precision is improved, but processing time increases
Solution Approach 1:
The system performs preliminary alignment actions before the die is fully positioned in the processing chamber. The robots pre-align dies using vision systems and reference markers during transport and positioning phases, so that when the die reaches its final position, alignment is already substantially complete, reducing the time needed for final precision adjustment.
Solution Approach 2:
Manual alignment operations are replaced with automated optical and mechanical alignment systems. The robots use vision systems, laser alignment tools, and precision positioning mechanisms to achieve rapid automated alignment, substituting slow manual adjustment with fast computer-controlled positioning that maintains high precision while reducing time.
Data Source
AI summary
A system and computer-implemented method are provided for manufacturing a semiconductor electronic device. An assembler receives a jig and a boat supporting a die. The assembler includes a separator that separates the jig into a first jig portion and a second jig portion and a loader that positions the boat between the first jig portion and the second jig portion. A robot receives an assembly prepared by the assembler and manipulates a locking system that fixes an alignment of the boat relative to the first jig portion and the second jig portion to form a locked assembly. A process chamber receives the locked assembly and subjects the locked assembly to a fabrication operation.