Semiconductor Die Keystream Encryption for Low-Latency Data Transfer
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Solution Overview
Problem
Existing data transfer techniques in semiconductor devices increase latency, power consumption, and resource utilization due to inefficient data security measures, particularly in system-on-chip (SoC) environments.
Innovation Solution
Implementing a low-overhead encryption scheme using a keystream generator and a START/STOP command across semiconductor dies to secure data transfer without significantly increasing latency or resource usage, synchronized through a physical interface without time-based metadata.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If data security techniques are used to protect data during transfer between semiconductor dies, then data security is improved, but latency increases
Solution Approach 1:
The encryption key and initial value are pre-loaded into the keystream generators of both transmitting and receiving semiconductor dies before data transfer begins. This preliminary setup allows the keystream to be generated locally without real-time communication overhead, eliminating the latency that would otherwise be introduced by encryption/decryption processing during data transfer.
Solution Approach 2:
A synchronization command is introduced as an intermediary signal to coordinate between transmitting and receiving dies. This command initiates decryption at the receiving die and ensures both ends are synchronized, allowing secure data transfer to proceed without the latency of continuous security protocol negotiations.
2Reliability
If data security techniques are used to protect data during transfer between semiconductor dies, then data security is improved, but power consumption increases
Solution Approach 1:
The encryption key and initial value are pre-loaded into the keystream generators before data transfer begins. This preliminary setup allows the keystream to be generated locally without real-time communication overhead, eliminating the power consumption that would otherwise be required for continuous encryption/decryption processing during data transfer.
3Reliability
If data security techniques are used to protect data during transfer between semiconductor dies, then data security is improved, but device resource utilization increases
Solution Approach 1:
The encryption key and initial value are pre-loaded into the keystream generators before data transfer begins. This preliminary setup allows the keystream to be generated locally without real-time communication overhead, eliminating the resource utilization that would otherwise be required for continuous encryption/decryption processing during data transfer.
4Stability of the object's composition
If time-based metadata is used for synchronization, then coordination between semiconductor dies is improved, but race conditions occur and resource overhead increases
Solution Approach 1:
Instead of using time-based metadata to achieve synchronization, the patent inverts the approach by using a simple start/stop command mechanism. The transmitting die sends a start command to initiate decryption at the receiving die, and both dies independently generate keystreams based on pre-loaded keys without relying on time-based coordination, thereby eliminating race conditions.
Data Source
AI summary
A semiconductor die includes an input interface configured to receive data to be transferred to at least one other semiconductor die. The semiconductor die further includes a keystream generator configured to generate a keystream based on a key and an initial value. The semiconductor die further includes encryption circuitry coupled to the keystream generator. The encryption circuitry is configured to generate a command to initiate decryption and is further configured to generate encrypted data based on the data and the keystream. The semiconductor die further includes an output interface coupled to the encryption circuitry. The output interface is configured to output the command and the encrypted data to a physical interface with the at least one other semiconductor die.